Strain Sensor Assembly with Drawn Cup and Wafer
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Solution Overview
Problem
Existing strain sensors face challenges such as fragility, difficulty in mounting, and calibration when measuring strain in components like brakes and suspension arms, which are not adequately monitored by current instruments.
Innovation Solution
A strain sensor assembly utilizing a drawn cup technology with a strain wafer attached to the end wall, featuring elongated slots and various surface configurations to enhance sensitivity, which can be slidably inserted into an object to measure strain, and optionally combined with additional sensors for torque, temperature, acceleration, and vibration measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional strain sensors are used to measure strain in components, then strain measurement capability is provided, but the sensors suffer from fragility and difficulty in mounting
Solution Approach 1:
The patent combines the strain sensor with a mounting cup assembly into an integrated unit. The strain wafer is bonded to the end wall of the cup, creating a unified structure that is mounted as a single component onto the test specimen. This integration eliminates the need for separate mounting operations and reduces the risk of damage during installation, thereby improving both reliability and ease of operation.
Solution Approach 2:
The strain wafer is pre-bonded to the cup's end wall during manufacturing, before the assembly is installed on the test specimen. This preliminary action ensures the sensor is securely attached and properly positioned before field installation, reducing mounting complexity and potential damage during installation procedures.
2Reliability
If strain sensors are made more robust to reduce fragility, then durability improves, but sensitivity to strain measurement may decrease
Solution Approach 1:
The cup structure provides robust protection and mounting capability, while the strain wafer maintains its thin, sensitive configuration for accurate measurement. The localized bonding of the strain wafer to the cup's end wall allows the sensor to remain sensitive to strain while the cup provides structural durability and protection.
Solution Approach 2:
The assembly combines different materials and structures - the cup provides mechanical strength and durability, while the strain wafer (typically a thin foil or semiconductor element) provides sensitive strain detection. This composite approach allows each component to optimize its specific function without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust and sensitive strain measurement system that can effectively monitor strain in objects, improving the accuracy and reliability of strain detection while addressing the fragility and mounting issues of traditional sensors.
Implementation Method 1
a strain wafer disposed on one of an outer surface and an inner surface of the end wall
Data Source
AI summary
An assembly for sensing an amount of strain in an object, including a first cup having a first end, a second end, a cylindrical side wall extending therebetween, and an end wall disposed at the first end of the first cup, and a strain wafer disposed on one of an outer surface and an inner surface of the end wall.