Integrated Strain Sensor with Movable Beam and Magnetic Resistance Detection
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Solution Overview
Problem
Current strain sensors face challenges in downsizing and achieving high sensitivity for micro region measurements due to difficulties in bonding semiconductor sensor chips with control circuit chips, limiting their ability to accurately detect strain fluctuations.
Innovation Solution
A strain and pressure sensing device is designed with a semiconductor circuit unit and a sensing unit, featuring a movable beam with interconnect layers and a strain sensing element unit that includes a magnetic layer, allowing for adjustable distance between the transistor and the movable portion, enabling high sensitivity strain detection through magnetic resistance changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a semiconductor sensor chip including an acoustic detection unit is electrically connected to a control circuit chip by bonding wires, then the device can detect pressure fluctuations from vibrations, but downsizing of the device is difficult and it is difficult to measure strain with high sensitivity for a micro region
Solution Approach 1:
The patent combines the acoustic detection unit and control circuit into a single integrated device, eliminating the need for separate chips and bonding wires. This merging enables both downsizing and high-sensitivity strain measurement in a compact configuration.
Solution Approach 2:
The patent employs a three-dimensional stacked configuration where the acoustic detection unit and control circuit are arranged vertically rather than horizontally. This dimensional change allows compact integration while maintaining measurement sensitivity.
2Reliability
If bonding wires are used to connect sensor chip and control circuit chip, then electrical connection is achieved, but the device structure becomes complex and large
Solution Approach 1:
The patent integrates the control circuit directly with the acoustic detection unit, eliminating separate chips and bonding wires. This single-integrated-structure approach maintains reliable electrical connection while dramatically simplifying the overall device structure.
Solution Approach 2:
The patent extracts and eliminates the bonding wire connection method, replacing it with direct integration. This removes the complexity associated with wire bonding while preserving electrical connectivity through on-chip interconnections.
3Measurement precision
If conventional strain sensor configuration is used, then basic strain detection is possible, but high sensitivity measurement for micro regions cannot be achieved
Solution Approach 1:
The patent employs a movable beam structure with localized strain sensing elements positioned at specific regions where strain concentration occurs. This local quality enhancement enables high-sensitivity detection in micro regions while maintaining overall device simplicity.
Solution Approach 2:
The patent uses a movable beam that dynamically responds to strain changes, allowing the sensing element to move with the measured object. This dynamic configuration enhances sensitivity for micro region measurements while keeping the device easy to operate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves high sensitivity strain measurement for micro regions, enabling efficient strain and pressure sensing, and can be integrated into microsystems like microphones, facilitating downsizing and reducing power consumption.
Implementation Method 1
enabling high sensitivity strain detection through magnetic resistance changes
Data Source
AI summary
According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion.