Multipoint Strain Sensor Via Hole Interconnect
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Solution Overview
Problem
Conduction failures occur in strain sensors due to slippage during lamination, and the multi-layer structure increases material and production costs.
Innovation Solution
A multipoint-measurement strain sensor with strain-sensing parts and routing circuits on different surfaces of the same substrate film, connected via conductive paste through via holes, eliminating the need for lamination and reducing the number of layers to prevent conduction failures and lower production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer structure with lamination is used to connect strain-sensing parts and routing circuits, then conduction connection is achieved, but slippage occurs during lamination causing conduction failure and increasing material and production costs
Solution Approach 1:
The patent merges the strain-sensing parts and routing circuits into a single integrated substrate, eliminating the need for separate lamination of multiple layers. The strain-sensing parts are formed on the front surface while routing circuits are formed on the back surface of the same substrate, with conductive members providing direct electrical connection without requiring lamination processes.
Solution Approach 2:
The patent extracts and eliminates the lamination process from the manufacturing sequence by integrating both functional elements (strain-sensing parts and routing circuits) into one substrate. This removes the source of slippage-related conduction failures that occur during lamination of separate gauge bases and substrates.
2Adaptability or versatility
If multiple layers are laminated to achieve multipoint measurement functionality, then measurement capability is improved, but material cost and production cost increase considerably
Solution Approach 1:
The patent combines multiple functional elements (multiple strain-sensing parts and routing circuits) into a single substrate structure. This allows multipoint measurement capability to be achieved without requiring multiple separate layers to be laminated, thereby reducing material costs and simplifying the manufacturing process.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical insulation, and mounting for both strain-sensing parts and routing circuits. This multi-functionality eliminates the need for separate dedicated layers for each function, reducing overall material usage and production complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents conduction failures and reduces material and production costs by eliminating the need for lamination and minimizing the number of layers, while protecting against oxidation and corrosion.
Implementation Method 1
conductive paste 41, 42 filled in via holes 39, 40 to connect the strain-sensing parts 33 and the routing circuits 37, 38
Data Source
AI summary
A multipoint-measurement strain sensor which is free of a conduction failure originated from slippage at the time of lamination and which can reduce the material cost, and a method for producing the multipoint-measurement strain sensor are provided. A multipoint-measurement strain sensor 31 of the present invention includes a substrate film 34, a plurality of strain-sensing parts 33 formed on a first main surface 34a of the substrate film 34, routing circuits 37, 38 formed, in correspondence with the respective strain-sensing parts 33, on a second main surface 34b of the substrate film 34, and having outer connection terminals 37b, 38b near an outer edge of the substrate film 34, and a conductive paste 41, 42 to fill via holes 39, 40 such that each of the strain-sensing parts 33 is connected to the corresponding routing circuit 37, 38.