Strained III-V Semiconductor Lattice Parameter Determination

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Solution Overview

Problem

Current methods for determining lattice parameters in strained III-V semiconductor layers, such as those in GaN/AlxGa(1-x)N HEMT structures, face challenges with low intensity peaks and peak overlaps, leading to qualitative data rather than precise Al content determination due to assumptions about constant strain, which limits the accuracy of Al concentration measurement in the barrier layer.

Innovation Solution

A method involving Qx and Qz scans in reciprocal space using HRXRD to decouple layer composition and strain, allowing for precise determination of lattice parameters, strain, and Al content in the AlxGa(1-x)N barrier layer by aligning diffracted X-Ray peaks and measuring intensity, providing a 2-dimensional scan for accurate peak separation and parameter measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional Omega-2Theta scans on 002, 004 and 006 reflections are used, then the measurement can be performed with standard equipment, but the low intensity peaks and peak overlaps prevent precise lattice parameters determination

Engineering Contradiction:
Improvelattice parameters determination precisionVSAvoidpeak intensity and overlap
Core Design Contradiction:
Measurement precisionVSDifficulty of detecting and measuring

Solution Approach 1:

The patent transitions from conventional 1-dimensional Omega-2Theta scans to 2-dimensional reciprocal space maps (RSM) that plot diffraction intensity as a function of both omega and 2theta angles simultaneously. This dimensional expansion allows separation of overlapping peaks in the reciprocal space, enabling precise determination of lattice parameters for strained layers by resolving peaks that appear overlapping in traditional scans.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If 1-dimensional Omega-2Theta scans are used, then the measurement process is simple, but the scans cannot resolve the influence of composition and strain on lattice parameters

Engineering Contradiction:
ImproveAl content determination accuracyVSAvoidscan dimensionality
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent implements 2-dimensional reciprocal space maps that simultaneously vary omega and 2theta angles, creating a comprehensive diffraction pattern that resolves the coupled effects of composition and strain. The RSM displays diffraction peaks as elongated features where the orientation and shape encode information about both lattice parameter changes due to composition (Al content) and strain, allowing decoupling of these effects through pattern analysis.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent utilizes changes in diffraction peak position, shape, and orientation in reciprocal space as functions of omega and 2theta angles to extract information about composition and strain. By analyzing how peak parameters evolve across the 2-dimensional reciprocal space map, the method simultaneously determines Al content and strain state without requiring separate measurements or assumptions.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If strain is assumed to be constant and maximal (100%), then the analysis can be simplified, but this assumption introduces further error in the Al content determination

Engineering Contradiction:
ImproveAl content determination accuracyVSAvoidstrain analysis complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent employs an iterative fitting procedure where initial estimates of composition and strain are used to simulate expected RSM patterns, which are then compared to experimental data. The discrepancy between simulated and measured patterns provides feedback for refining the composition and strain parameters in subsequent iterations, gradually converging to self-consistent values that accurately represent the actual sample state without requiring initial assumptions about strain magnitude.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables high precision and accuracy in determining Al content and strain in the barrier layer, overcoming the limitations of conventional methods by providing absolute values and refining the measurement of Al concentration with reduced error.

Implementation Method 1

generating a first scan of the multi-layer arrangement in a Qx direction for a chosen reflection in reciprocal space based on diffracted X-Ray beam intensity measurements

Methodology Applied
Scientific EffectX-Ray diffraction: Bragg Diffraction

Data Source

PatentUS10132765B2Method and apparatus for determining lattice parameters of a strained III-V semiconductor layer
Publication Date: 2018.11.20 INFINEON TECH AUSTRIA AG
  • US10132765B2 patent drawing
  • US10132765B2 patent drawing
  • US10132765B2 patent drawing

AI summary

A multi-layer arrangement of III-V semiconductor layers includes a strained III-V semiconductor layer having a concentration of a constituent element which effects intensity of a conductive channel formed in the multi-layer arrangement. Lattice parameters of the strained III-V semiconductor layer are determined by generating a first scan in a Qx direction for a chosen reflection in reciprocal space based on diffracted X-Ray beam intensity measurements in the Qx direction. A second scan is generated in a Qz direction for the chosen reflection in the reciprocal space based on diffracted X-Ray beam intensity measurements in the Qz direction. The second scan is aligned with a diffracted X-Ray peak in the first scan which identifies the strained III-V semiconductor layer. The degree of strain of the strained III-V semiconductor layer is determined based on the first scan and the concentration of the constituent element based on the second scan.