Stranded Wire Contact Diffusion Bonding Without Solder Heat Damage
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Solution Overview
Problem
Existing methods for creating stranded contacts in electrical components, such as inductive components, face challenges with insulation removal during soldering, leading to damage, increased risk of failure, and high costs due to high temperatures and unwanted solder balls.
Innovation Solution
The use of thermal diffusion bonding to connect individual wires in a stranded wire to a contact piece without separate insulation removal, using a metallic contact piece that is electrically conductive and mechanically fixative, allowing for an intimate atomic-level connection at temperatures below the materials' melting points, thus avoiding soldering and its associated issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering processes are used to create stranded wire contacts, then mechanical and electrical connections are established, but the high temperatures cause damage to insulation and functional elements
Solution Approach 1:
The patent changes the temperature parameter from soldering temperatures (400°C) to diffusion bonding temperatures (below melting point of materials), thereby establishing strong connections without thermal damage to insulation and functional elements
Solution Approach 2:
The patent replaces the thermal-melting mechanism of soldering with a solid-state diffusion bonding mechanism, where atomic diffusion at elevated temperatures creates strong metallurgical bonds without requiring the materials to melt
2Ease of manufacture
If high temperatures are used to remove insulation during soldering, then insulation is effectively removed, but solder balls are created and component reliability decreases
Solution Approach 1:
The patent performs insulation removal as a preliminary step before diffusion bonding, using mechanical or chemical methods at low temperatures, thereby eliminating the need for high-temperature insulation removal and preventing solder ball formation
Solution Approach 2:
The patent converts the previously harmful effect of high temperatures into a beneficial controlled thermal process where moderate heat is used solely for diffusion bonding after insulation is already removed, eliminating harmful side effects while maintaining bonding effectiveness
3Ease of manufacture
If two-step manufacturing processes are used for high-temperature insulation, then insulation is reliably removed, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges the insulation removal step and the connection creation step into a unified manufacturing flow, where insulation is removed first and then diffusion bonding is performed in a controlled sequence, simplifying the overall process while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a reliable, cost-effective, and solder-free connection that prevents damage to nearby components, eliminates solder balls, and ensures a strong mechanical and electrical bond between the stranded wire and the contact piece.
Implementation Method 1
The contact piece is connected to the stranded wire by thermal diffusion bonding. In diffusion bonding, the individual wires are bonded to the contact piece under pressure and at elevated temperatures. The temperature is lower than the melting point of the contact piece material and the material of the individual wires. In diffusion bonding, two-way diffusion occurs at the atomic level across the interfaces of the parts to be joined, creating an intimate connection between the parts.
Data Source
Figure 1A~1B
Figure 2~3A
Figure 3B~3C
AI summary
The invention relates to an electric component (8) having a strand contact (1), comprising a strand wire (2) with a plurality of individual wires (4) and a contact piece (100) for electrically contacting the strand wire (2), the strand contact (1) being produced by thermal diffusion bonding.