Stranded Wire Terminal Region Using Diffusion-Bonded Enclosure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for creating terminal regions for electrical devices with stranded wires are difficult to control, often result in non-compact shapes with cavities, and require additional elements or materials like solder, which can cause damage.
Innovation Solution
A terminal region design featuring a metallic enclosure piece that surrounds the stranded wire, connected through thermal diffusion bonding, eliminating the need for separate insulation removal and soldering, and allowing for flexible shaping and compact formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If insulation removal is done by immersion in hot solder bath, then insulation is removed from stranded wire, but the process is difficult to control and leads to quality shortcomings with cavities remaining in terminal region
Solution Approach 1:
The patent extracts the harmful effect of hot solder bath immersion by replacing it with a controlled mechanical insulation removal process using a cutting tool that precisely removes insulation without affecting the wire structure or creating cavities
Solution Approach 2:
The patent replaces the thermal-mechanical process of hot solder bath immersion with a purely mechanical cutting process using a cutting tool, providing better control and eliminating the harmful effects of heat and uncontrolled material removal
2Adaptability or versatility
If prefabricated cable lug or annular cable lug is used to terminate stranded wire, then terminal region is formed, but thickness of terminal region increases and flexibility is reduced
Solution Approach 1:
The patent merges the functions of insulation removal, wire termination, and connection preparation into a single integrated process where the cutting tool both removes insulation and forms the terminal region, eliminating the need for separate cable lugs and reducing overall thickness
Solution Approach 2:
The cutting tool performs multiple functions: it removes insulation from the stranded wire and simultaneously shapes the terminal region to the desired form, providing a universal solution that eliminates the need for additional components like cable lugs
3Reliability
If solder material or conductive adhesive is used for electrical connection, then electrical connection is achieved, but damage occurs due to heat evolution or solder balls are created
Solution Approach 1:
The patent extracts and eliminates the need for solder material or conductive adhesive by creating a terminal region through mechanical cutting that provides direct electrical connection capability, removing the source of heat evolution and solder ball formation
Solution Approach 2:
The patent replaces the thermal process of soldering with a mechanical cutting process that prepares the terminal region for direct electrical connection, eliminating the harmful thermal effects and solder-related problems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, soldering-free terminal region with improved electrical and mechanical stability, reducing the risk of damage and achieving efficient electrical connection directly to the printed circuit board.
Implementation Method 1
the enclosure piece is connected with the individual wires of the stranded wire by thermal diffusion bonding. In thermal diffusion bonding the individual wires and the enclosure piece are connected together through exposure to pressure and elevated temperature
Implementation Method 2
During thermal diffusion bonding, for example, the insulation of the individual wires and/or the external insulation of the stranded wire is melted
Data Source
AI summary
An electrical device having a terminal region for connection with a printed circuit board. The terminal region has a stranded wire and an enclosure piece surrounding the stranded wire. The enclosure piece is connected with the stranded wire, for example, by thermal diffusion bonding.