Strap Cell Gate Layout for Lower RC Memory Circuits

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Solution Overview

Problem

Non-optimized layouts in integrated circuits (ICs) lead to unnecessary circuitry and increased die area, degrading circuit performance and speed due to unnecessary loads.

Innovation Solution

The layout structure includes bit cells, strap cells, and logic cells, with strap cells positioned between bit cells and logic cells, utilizing a specific arrangement of gates and connection structures to minimize layout area and reduce RC constant, thereby enhancing operational speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a non-optimized layout is used in integrated circuits, then the circuit may have simpler structure, but the die area increases and circuit speed degrades due to unnecessary circuitry and loads

Engineering Contradiction:
Improvecircuit structureVSAvoidcircuit speed
Core Design Contradiction:
Device complexityVSSpeed

Solution Approach 1:

The patent removes unnecessary circuitry and loads from the circuit layout, extracting only the essential functional elements needed for operation. This eliminates parasitic capacitances and resistances that degrade performance while maintaining the required circuit functionality.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The circuit layout is segmented into functional blocks with optimized interconnections. By dividing the circuit into discrete, efficiently connected segments, the patent reduces unnecessary signal paths and minimizes parasitic effects while maintaining structural simplicity.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If a non-optimized layout is used in integrated circuits, then the circuit may have simpler structure, but the die area increases due to unnecessary circuitry

Engineering Contradiction:
Improvecircuit structureVSAvoiddie area
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The patent merges adjacent circuit elements and shares common structures between multiple functions. By combining elements that can serve multiple purposes or are positioned close together, the design reduces the total die area while keeping the structural complexity manageable.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes three-dimensional packaging and vertical stacking of circuit layers to reduce the planar die area. By extending the circuit architecture into the vertical dimension, more functionality is packed into a smaller footprint without significantly increasing lateral complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If unnecessary loads are present in the circuit, then the circuit structure may be simpler, but the operational speed degrades

Engineering Contradiction:
Improvecircuit structureVSAvoidoperational speed
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent extracts and removes unnecessary loads and parasitic elements from the circuit path. By eliminating these non-essential components, the circuit achieves faster switching speeds and reduced signal propagation delays without requiring complex compensation structures.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12132041B2Semiconductor device
Publication Date: 2024.10.29 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12132041B2 patent drawing
  • US12132041B2 patent drawing
  • US12132041B2 patent drawing

AI summary

A method, includes: in a strap cell disposed between a memory cell and a logic cell, arranging a first gate across an active region; arranging a second gate next to and in parallel with the first gate and at an end of the active region; and when at least one conductive segment has a first length, arranging the at least one conductive segment across the first gate, the second gate, and no dummy gate in the strap cell. A semiconductor device is also disclosed herein.