Wearable Strap Electronics Encapsulation via Membrane Compression
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Solution Overview
Problem
Wearable device straps face challenges in combining electronic components within a small volume while maintaining comfort, flexibility, and a water-tight seal, as existing materials either deform or become uncomfortable when bent, and hard materials compromise flexibility.
Innovation Solution
A method involving a printed circuit board (PCB) with electronic components, a membrane, and a chassis, where the membrane is applied over the components and compressed by the chassis to create a fluid-tight seal using a wet applied structural component, while leaving certain components like buttons unsealed to remain operable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If harder materials are used for the strap, then the strap provides better protection for electronic components, but the strap becomes less comfortable and less flexible
Solution Approach 1:
The strap is divided into different material zones: a harder protective region containing the electronics and a softer flexible region for comfort. This segmentation allows each zone to optimize its properties independently, resolving the contradiction between protection and comfort.
Solution Approach 2:
The strap uses composite construction with at least two different materials: a harder material for structural protection and a softer material for comfort. This composite approach enables simultaneous achievement of strength and flexibility in different parts of the same component.
2Ease of operation
If the strap is made flexible and soft, then the strap is comfortable to wear, but the internal components deform and protrude when bent
Solution Approach 1:
The strap structure separates the flexible outer layer from the rigid internal component housing. This segmentation allows the outer strap to bend freely for comfort while the internal components remain protected in a rigid enclosure that prevents deformation.
Solution Approach 2:
The rigid protective housing containing the electronics is nested within the flexible strap structure. This nested arrangement allows the outer flexible layer to deform independently while the inner rigid layer maintains component shape and position.
3Reliability
If a wet applied structural component is used to seal the strap, then a water and dirt proof seal is achieved, but buttons and other operable components become inoperable
Solution Approach 1:
Buttons and operable components are extracted from the sealed region and placed in unsealed accessible areas. This allows the wet applied structural component to provide comprehensive sealing for the electronics while leaving buttons exposed and functional.
Solution Approach 2:
The sealing property is applied locally only to regions requiring protection (electronics compartment) while leaving regions requiring interaction (buttons) unsealed. This localized application of sealing resolves the contradiction between waterproofing and operability.
4Ease of manufacture
If through holes are used for soldering pins, then electrical connections are established, but short circuits can occur between pins and electrified portions
Solution Approach 1:
Instead of using through holes that pass completely through the PCB, blind holes are used that terminate before reaching the other side. This inverted approach to hole configuration prevents pins from contacting electrified portions on the opposite side, eliminating short circuit risks while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a comfortable, flexible, and water-tight strap that allows for the integration of electronic components like transmitters and buttons, ensuring the strap remains functional and aesthetically appealing while preventing water and dirt ingress.
Implementation Method 1
injecting a wet applied structural component into said mould
Implementation Method 2
attaching a chassis to said PCB at said electronic component such that said membrane is urged towards said electronic component
Data Source
AI summary
Herein disclosed is a method of manufacturing a strap comprising providing a mould for a strap, the strap comprising a first opening and a second opening, providing a printed circuit board (PCB), comprising at least one electronic component, applying a membrane to said electronic component, attaching a chassis to said PCB at said electronic component such that said membrane is sealed against said electronic component; injecting a wet applied structural component into said mould.


