Strengthening Layer for Thin Die Packaging
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Solution Overview
Problem
Conventional packaging structures for thin dies are prone to damage during the packaging process due to insufficient structural strength, which can lead to fracture under pressure and thermal expansion/contraction stresses.
Innovation Solution
A packaging structure comprising a substrate, a thin die, a strengthening layer, and an encapsulation body, where the strengthening layer is disposed on the thin die to bear pressure and stress during encapsulation, protecting the die from damage, and can be made of materials like thermosetting materials or dummy dies with optional adhesive and metal layers for additional support and shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the die is thinned to enable miniaturization of packaging structures, then the size of the packaging structure is reduced, but the structural strength of the die becomes insufficient making it liable to fracture during packaging
Solution Approach 1:
A support layer is introduced as an intermediary component between the thin die and the encapsulation body. This support layer acts as a mediator that bears the pressure and stress during encapsulation, protecting the thin die from direct mechanical stress while enabling the miniaturized packaging structure to maintain sufficient structural strength
2Ease of manufacture
If conventional encapsulation is used on thin dies, then the packaging process can be completed, but the die fractures under pressure during injection molding
Solution Approach 1:
The support layer is disposed on the thin die before the encapsulation process begins. This preliminary action ensures that the die is pre-protected with additional structural support, allowing the subsequent injection molding process to proceed without causing die fracture, thus maintaining both manufacturability and reliability
3Productivity
If heating is applied to speed up encapsulant curing, then the curing process is accelerated, but thermal expansion and contraction squeeze the die causing damage
Solution Approach 1:
The support layer serves as a cushioning layer that is disposed on the thin die before thermal processing. During heating and cooling cycles, this support layer absorbs and distributes the thermal stress and mechanical stress from expansion and contraction, protecting the thin die from damage while allowing rapid curing to proceed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The strengthening layer effectively absorbs pressure and stress during encapsulation, preventing damage to the thin die and allowing for miniaturization of packaging structures while maintaining structural integrity.
Implementation Method 1
The strengthening layer bears a pressure or stress during the formation of the encapsulation body to protect the thin die
Implementation Method 2
The encapsulation body is formed on the substrate and covers both the thin die and the strengthening layer
Implementation Method 3
the substrate or the encapsulant that experiences the thermal expansion or contraction tends to squeeze the die to cause damage of the die
Data Source
AI summary
A packaging structure for thin die is provided. The packaging structure has a substrate, a thin die, a strengthening layer and an encapsulation body. The thin die is disposed on and electrically connected with the substrate; the strengthening layer is disposed on the thin die; and the encapsulation body is formed on the substrate and covers both the thin die and the strengthening layer. The strengthening layer can bear pressure or stress during the formation of the encapsulation body to protect the thin die. A method for manufacturing the packaging structure for the thin die is further provided to manufacture the above packaging structure for the thin die.