Ultra-thin Micro-components Using Stress Compensation Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current micro and nano system technologies face challenges in producing detachable, space-saving components due to mechanical stresses that cause warping and deformation, which are typically addressed by using rigid substrates that increase component thickness and reduce miniaturization efficiency.
Innovation Solution
The implementation of stress compensation layers through chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes, allowing for mechanical stress compensation without a rigid substrate, enabling the production of ultra-thin components that prevent warping and facilitate integration into technical systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid substrates are used to absorb mechanical stresses, then warping and deformation are prevented, but component thickness increases and miniaturization is reduced
Solution Approach 1:
The patent extracts and removes the rigid substrate from the component structure, retaining only the essential functional layers. This extraction eliminates the substrate's thickness (e.g., 525 μm for 4-inch wafer) while maintaining stress compensation through alternative means, achieving ultra-thin components (e.g., 50 μm or less) without warping.
Solution Approach 2:
The patent changes the mechanical stress parameters of the remaining component layers to compensate for the absence of the rigid substrate. By adjusting the stress characteristics of thin functional layers through controlled deposition processes (CVD, PVD), the component maintains dimensional stability without requiring thick substrate support.
2Length of stationary object
If substrate thickness is reduced through grinding and etching, then miniaturization is improved, but manufacturing work and costs increase
Solution Approach 1:
The patent performs preliminary stress compensation during the layer deposition process itself, rather than requiring subsequent substrate thinning operations. By controlling the mechanical stress parameters during CVD or PVD deposition, the component achieves the desired thin profile and stress balance in one step, eliminating the need for separate grinding and etching operations.
3Length of stationary object
If complete wafer removal is attempted, then miniaturization is maximized, but component stability and adhesion are compromised
Solution Approach 1:
The patent changes the stress parameters of the functional layers to compensate for complete wafer removal. By carefully controlling the mechanical stress characteristics during deposition, the thin layers maintain strong adhesion to each other and achieve dimensional stability without requiring the supporting wafer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in mechanically stress-compensated components with reduced thickness, enabling flat and functional integration into various systems without the need for substrate removal, thus enhancing miniaturization and reducing manufacturing costs.
Implementation Method 1
The component (2) has at least one stress compensation layer (5) with a predetermined mechanical stress, so that the stress compensation layer (5) at least partially compensates for at least one mechanical stress of the component (2)
Implementation Method 2
The implementation of stress compensation layers through chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes
Implementation Method 3
The implementation of stress compensation layers through chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes
Data Source
Figure 1~4
Figure 5~7
Figure 8~9
AI summary
The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.