Stress-Controlled Metal Layer Pellicle for EUV Lithography
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Solution Overview
Problem
In Extreme Ultraviolet (EUV) lithography, existing pellicles face challenges in maintaining low stress levels and efficient heat dissipation, which affect the resilience and performance of the pellicle over time, leading to potential distortions in patterned light and reduced manufacturing yield.
Innovation Solution
A pellicle with a stress-controlled metal layer is manufactured using a process that includes forming a non-metal layer and a stress-controlled metal layer on a substrate, with specific deposition parameters such as temperature, power, and pressure controlled to achieve stress levels between 500 MPa and 50 MPa, enhancing resilience and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a metal layer is deposited on the pellicle to control stress, then stress levels can be maintained between 500 MPa and 50 MPa, but the deposition process requires precise control of temperature, power, and pressure parameters
Solution Approach 1:
The patent applies parameter changes by systematically adjusting deposition parameters (temperature from room temperature to 100°C, power from 100W to 450W, pressure from 10mT to 25mT) to control the stress state of the metal layer. This allows achieving the desired stress range (500-50 MPa) through controlled variation of physical parameters during deposition.
Solution Approach 2:
The patent implements feedback control by measuring stress values after deposition and using this information to adjust subsequent deposition parameters. The stress measurement feedback enables iterative optimization to maintain stress within the target range, resolving the contradiction between stress stability and process complexity.
2Temperature
If the pellicle is designed for efficient heat dissipation, then thermal management is improved, but stress control becomes more challenging
Solution Approach 1:
The patent resolves the contradiction between heat dissipation and stress control by changing the temperature parameter during deposition. By controlling substrate temperature (room temperature to 100°C) and deposition conditions, the patent achieves both efficient heat dissipation pathways and desired stress levels (500-50 MPa) in the metal layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stress-controlled pellicle exhibits improved resilience and reduced stress variation, leading to higher manufacturing yield and longer-term performance by maintaining low stress levels and efficient heat dissipation, thus minimizing distortions in EUV lithography systems.
Implementation Method 1
enhancing resilience and heat dissipation
Data Source
AI summary
A pellicle comprises a stress-controlled metal layer. The stress in said metal layer may be between about 500-50 MPa. A method of manufacturing a pellicle comprising a metal layer includes deposing said metal layer by plasma physical vapor deposition. Process parameters are selected so as to produce a desired stress value in said metal layer, such as between about 500-50 MPa.