Stress Luminescence Measurement for Flexible Device Defect Detection
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Solution Overview
Problem
Current stress luminescence measurement methods struggle to accurately detect defect occurrence positions in flexible devices due to difficulties in visualizing changes in the appearance of stress luminescent materials under light-shielded conditions, leading to potential erroneous detection of defect locations.
Innovation Solution
A stress luminescence measurement method and device that involves placing a stress luminescent material on a sample, irradiating it with excitation light, capturing images before and after applying a load, and storing these images to accurately detect defects by analyzing changes in luminescence patterns, allowing for precise identification of defect positions and timing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If stress luminescence measurement is performed in a light-shielded state to detect defect timing, then the timing detection capability is improved, but the ability to accurately detect defect occurrence position deteriorates
Solution Approach 1:
The measurement process is segmented into two distinct phases: (1) light-shielded stress luminescence measurement for timing detection, and (2) illuminated appearance measurement for position detection. This segmentation allows each measurement to be optimized for its specific purpose without interference from the other conditions.
Solution Approach 2:
The stress luminescence measurement in light-shielded state is performed as a preliminary action to detect defect timing. This preliminary detection provides temporal information that guides subsequent position analysis, establishing a sequence where timing information is obtained first to inform later spatial analysis.
2Measurement precision
If image analysis processing is performed on stress luminescence images to accurately detect defect position, then the position detection accuracy is improved, but the measurement complexity increases
Solution Approach 1:
Normal illuminated imaging serves as an intermediary measurement that captures appearance changes without requiring complex analysis of stress luminescence patterns. This intermediary data provides direct visual information about defect positions, simplifying the overall measurement process while maintaining accuracy.
Solution Approach 2:
The method utilizes changes in visual appearance (analogous to color changes) of the stress luminescent material under normal illumination to indicate defect positions. These appearance changes provide intuitive, easily interpretable information that reduces the need for complex image processing algorithms.
3Ease of operation
If only stress luminescence measurement is used to detect defects, then the measurement simplicity is improved, but the reliability of defect localization deteriorates
Solution Approach 1:
The method merges two complementary measurement techniques: stress luminescence measurement (for timing and simplicity) and normal illuminated imaging (for position and reliability). By combining these measurements, the system achieves both operational simplicity and localization reliability that neither method could provide alone.
Solution Approach 2:
The stress luminescence measurement provides feedback on when defects occur, while the illuminated imaging provides feedback on where defects are located. This dual-feedback mechanism creates a reliable system where temporal and spatial information mutually validate each other, enhancing overall measurement reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate and easy detection of external changes caused by defects in flexible devices, improving the reliability of defect identification by correlating temporal changes in stress luminescence with load application, thereby enhancing the precision of defect localization and timing determination.
Implementation Method 1
a light-emitting film including a stress luminescent material is placed on a sample, and an external force is applied to the light-emitting film together with the sample to emit light of the stress luminescent material
Implementation Method 2
irradiating the stress luminescent material with excitation light; acquiring a first captured image by imaging the stress luminescent material during irradiation of the excitation light
Data Source
AI summary
A stress luminescence measurement method according to one aspect includes the steps of: placing a stress luminescent material on a surface of a sample; irradiating the stress luminescent material with excitation light; acquiring a first captured image by imaging the stress luminescent material during irradiation of the excitation light; applying a load to the sample; acquiring a stress luminescence image by imaging stress luminescence of the stress luminescent material; irradiating the stress luminescent material after removal of the load with the excitation light; acquiring a second captured image during irradiation of the excitation light by imaging the stress luminescent material in a state in which the load has been removed; and storing the first captured image and the second captured image in a memory in association with the stress luminescent image.