Stress-Neutralizing Layer for Flexible Display Wiring Integrity
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Solution Overview
Problem
Flexible display panels face challenges in maintaining the integrity of the wiring layer when bent, as existing technologies fail to effectively manage stress, leading to potential cracks.
Innovation Solution
A flexible display panel design incorporating a stress-neutralizing layer formed of the same material as the thin film encapsulation layer, which applies compressive stress to the wiring layer in the bending area, creating a neutral surface that balances tensile and compressive stress, thereby preventing cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the flexible display panel is bent to achieve flexibility, then the flexible substrate can be partially bent as needed, but the wiring layer may form cracks and lose integrity
Solution Approach 1:
The patent changes the stress state parameter of the wiring layer by introducing a compressive stress layer. This layer applies compressive stress to counterbalance the tensile stress generated during bending, transforming the stress distribution to prevent crack formation while maintaining flexibility
Solution Approach 2:
The patent uses a composite structure consisting of the flexible substrate, wiring layer, and compressive stress layer. The compressive stress layer is formed using the same material as the thin film encapsulation layer (organic film with inkjet process), creating a composite system that provides both flexibility and stress management
2Reliability
If a stress management layer is added to prevent wiring layer cracks, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The compressive stress layer serves multiple functions: it provides stress management to prevent cracks, acts as part of the encapsulation structure, and is formed using the same material and process as the thin film encapsulation layer. This multi-functionality reduces the need for separate dedicated stress management components
Solution Approach 2:
The patent merges the stress management function with the encapsulation layer by using the same organic film material for both the thin film encapsulation layer and the compressive stress layer. This consolidation reduces the number of distinct layers and simplifies the manufacturing process while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents crack formation in the wiring layer during bending, simplifying the manufacturing process and ensuring the integrity of the flexible display panel.
Implementation Method 1
a stress-neutralizing layer provided in the flexible substrate such that a compressive stress is applied to the wiring layer in the bending area
Data Source
AI summary
A flexible display panel and a method of manufacturing the same are disclosed. In one aspect, the flexible display panel includes a flexible substrate including a bending area, a display unit formed over the flexible substrate, and a thin film encapsulation layer covering the display unit. The flexible display panel further includes a wiring layer electrically connected to the display unit and formed over the bending area and a stress-neutralizing layer formed over the flexible substrate. The stress-neutralizing layer is configured such that a compressive stress is applied to the wiring layer when the bending area is bent. The stress-neutralizing layer includes a layer formed of the same material as the thin film encapsulation layer.