Stress Relief Apparatus for 3D Chip Stack Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional 3D chip stacks face challenges with stress relief and heat management, as existing mechanically flexible interconnections only alleviate vertical stress and rely on thermal throttling, which limits performance.
Innovation Solution
A stress relief apparatus that adjusts chip positioning in response to pressure, combined with heat sink walls and elastic thermal material for improved heat transfer, allowing for stress relief and heat management in multiple directions without sacrificing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a fixed-distance chip stack is implemented, then device density is increased, but stress causes warping and physical damage to components
Solution Approach 1:
The patent implements a dynamically adjustable chip stack distance mechanism that allows the spacing between chips to change in response to thermal expansion and stress conditions. This dynamic adjustment prevents warping and physical damage while maintaining high device density, resolving the contradiction between compact stacking and component integrity.
Solution Approach 2:
The patent changes the physical parameters of the chip stack by introducing adjustable spacers and flexible interconnection structures that modify the distance and alignment between chips. This allows the system to adapt to stress and thermal conditions, preventing damage while maintaining high density.
2Stress or pressure
If a mechanically flexible interconnection is used to relieve stress, then vertical stress is reduced, but cross-directional movement causes loss of electrical connection
Solution Approach 1:
The patent employs flexible interconnections that serve multiple functions: they relieve vertical stress through mechanical flexibility while simultaneously maintaining electrical connection stability through compliant conductive paths that accommodate cross-directional movement. This multi-functionality resolves the contradiction between stress relief and connection reliability.
Solution Approach 2:
The patent uses flexible interconnection structures with compliant conductive paths that can bend and deform to accommodate stress relief while maintaining electrical connectivity. These flexible structures prevent loss of connection during cross-directional movement, resolving the contradiction between stress reduction and connection stability.
3Temperature
If thermal throttling is implemented to manage heat, then overheating is prevented, but chip stack performance is limited
Solution Approach 1:
The patent extracts heat from the chip stack through integrated heat sink structures and thermal management components that actively remove excess heat. By taking out heat rather than merely throttling performance, the system maintains optimal temperature while preserving full chip stack performance capability.
Solution Approach 2:
The patent introduces thermal interface materials and heat transfer mediators between the chips and heat sinks that facilitate efficient heat removal. These intermediary thermal management components enable effective heat dissipation without requiring performance reduction, resolving the contradiction between temperature control and performance maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively relieves stress and manages heat in 3D chip stacks by allowing chip movement and heat dissipation, preventing physical damage and performance limitations, while maintaining electrical connections and circuitry functionality.
Implementation Method 1
The elastic thermal material receives heat generated within the chip stack, causing the elastic thermal material to expand locally
Implementation Method 2
The expansion of the elastic thermal material adjusts the positioning of the chip stack, thereby allowing the heat to transfer from the elastic thermal material to the heat sink walls where it is absorbed and removed from the chip stack
Data Source
AI summary
The present disclosure provides a system and method for relieving stress and providing improved heat management in a 3D chip stack of a multichip package. A stress relief apparatus is provided to allow the chip stack to adjust in response to pressure, thereby relieving stress applied to the chip stack. Additionally, improved heat management is provided such that the chip stack adjusts in response to thermal energy generated within the chip stack to remove heat from between chips of the stack, thereby allowing the chips to operate as desired without compromising the performance of the chip stack.