Stress Sensor for Hall Effect Compensation

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Solution Overview

Problem

Hall sensors embedded in semiconductor chips face sensitivity changes due to mechanical stress caused by environmental factors like temperature and humidity, which affect their accuracy and require effective compensation methods.

Innovation Solution

A stress sensor integrated into the semiconductor chip using a Wheatstone bridge configuration with p-type and n-type resistors, oriented at specific angles and doped levels to minimize temperature drift and mechanical stress-induced resistance changes, generating an output signal to compensate for Hall element sensitivity variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a Hall sensor is embedded in a semiconductor chip, then it can be integrated into compact devices, but mechanical stress from environmental factors causes sensitivity changes that reduce measurement accuracy

Engineering Contradiction:
Improveintegration compactnessVSAvoidsensitivity stability
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The compensation system is segmented into distinct functional components: stress sensors (Wheatstone bridge with p-type and n-type resistors) separate from Hall elements, allowing independent optimization of each component while maintaining overall integration. This segmentation enables the stress compensation function to be added without redesigning the entire Hall sensor structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Stress sensors act as intermediary elements that detect mechanical stress and generate compensation signals. These intermediary stress sensors mediate between the environmental mechanical stress and the Hall element, providing a corrective signal that stabilizes the Hall element's sensitivity without requiring fundamental changes to the Hall element itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If multiple Hall elements are connected in parallel to reduce offset, then offset is effectively reduced, but the complexity of the electronic circuit increases

Engineering Contradiction:
Improveoffset reductionVSAvoidcircuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The offset compensation function and stress compensation function are merged into a single integrated circuit architecture. The electronic circuit simultaneously performs parallel connection of Hall elements for offset reduction and processes signals from stress sensors for sensitivity compensation, reducing overall system complexity compared to separate compensation systems.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The electronic circuit is designed with multi-functionality, serving both to reduce offset through parallel Hall element connections and to compensate for sensitivity changes via stress sensor signal processing. This universal circuit design eliminates the need for separate dedicated circuits for each compensation function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If stress sensors with p-type and n-type resistors are integrated to compensate for piezo-Hall effect, then sensitivity compensation is achieved, but the device complexity increases

Engineering Contradiction:
Improvesensitivity compensationVSAvoidsensor structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

Different regions of the semiconductor chip are assigned different doping types (p-type and n-type resistors) with specific orientations to create localized stress sensitivity. This local quality differentiation allows the Wheatstone bridge to detect stress components in specific directions, enabling effective piezo-Hall effect compensation through spatially differentiated resistor properties.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The stress sensor utilizes a composite structure combining p-type and n-type semiconducting materials in a Wheatstone bridge configuration. This composite material approach leverages the complementary piezoresistive properties of opposite doping types to achieve full stress component measurement and compensation.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively compensates for sensitivity changes in Hall sensors, maintaining accuracy and stability across varying environmental conditions by using the stress sensor's output to adjust the Hall sensor's performance, reducing the influence of mechanical stress and temperature on the sensor's output.

Implementation Method 1

resistors R1 to R4, which form a Wheatstone bridge... The resistors R1 and R4 are p-type resistors and the resistors R2 and R3 are n-type resistors

Methodology Applied
Scientific EffectPiezoresistive effect: Piezoresistive Effect

Implementation Method 2

Hall sensors are magnetic field sensors, which are based on the Hall effect and deliver an electrical output signal, which is proportional to a predetermined component of the magnetic field

Methodology Applied
Scientific EffectHall effect: Hall Effect

Implementation Method 3

The alternating mechanical stress causes changes of the offset of the Hall elements and, because of the piezo-Hall effect, also changes of the sensitivity of the Hall elements

Methodology Applied
Scientific EffectPiezo-Hall effect:

Data Source

PatentUS9016135B2Stress sensor for measuring mechanical stresses in a semiconductor chip and stress compensated hall sensor
Publication Date: 2015.04.28 MELEXIS TECH NV
  • US9016135B2 patent drawing
  • US9016135B2 patent drawing
  • US9016135B2 patent drawing

AI summary

A stress sensor (1) for detecting mechanical stress in a semiconductor chip (2) has a Wheatstone bridge formed by four integrated resistors R1 to R4, the resistors R1 and R4 being p-type resistors and the resistors R2 and R3 being n-type resistors.