Stretch-Release Adhesive Assembly for Reworkable Light Modules

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Solution Overview

Problem

The assembly, disassembly, and reworking of complex electronic devices are time-consuming and labor-intensive, often causing unintended damage to components, which adversely affects reparability and reusability, and there is a need to enhance these processes to support a circular economy.

Innovation Solution

The use of stretch release adhesive tape, divided into sections, to adhere and bond components like the light source module and circuit substrate, allowing for simplified positioning and easy disassembly by reducing adhesiveness through stretching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional adhesive methods are used to bond components, then bonding strength is improved, but disassembly difficulty increases and component damage occurs

Engineering Contradiction:
Improvebonding strengthVSAvoiddisassembly ease
Core Design Contradiction:
StrengthVSEase of repair

Solution Approach 1:

The adhesive tape is segmented into multiple sections (first section, second section, third section) with different functions. The first section provides strong bonding, the second section serves as a release layer, and the third section enables disassembly. This segmentation allows the adhesive tape to simultaneously achieve strong bonding strength and ease of disassembly by distributing different functions across different segments.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The adhesive properties of the tape are dynamically changed through stretching. When the second section is stretched, the adhesive strength is reduced, enabling easy separation of components. This parameter change (from high adhesion to low adhesion) allows the same adhesive material to serve both bonding and release functions, resolving the contradiction between strong bonding and easy disassembly.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If complex assembly structures are used to position components, then positioning precision is improved, but device complexity increases

Engineering Contradiction:
Improvepositioning precisionVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The adhesive tape performs multiple functions simultaneously: it bonds components together, positions them precisely, and provides a disassembly mechanism. The first section bonds the light source module to the back frame, the second section serves as a release layer, and the third section bonds the circuit substrate while enabling disassembly. This multi-functionality eliminates the need for separate positioning structures, reducing device complexity while maintaining positioning precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The adhesive tape acts as an intermediary element between components, providing both positioning and bonding functions. Instead of using complex mechanical positioning structures, the adhesive tape's controlled adhesion properties serve as the positioning mechanism, simplifying the overall device structure while achieving precise component placement.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If strong bonding is used to ensure component stability, then reliability is improved, but reworkability deteriorates

Engineering Contradiction:
Improvecomponent stabilityVSAvoidreworkability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The bonding system transitions from a static strong bond to a dynamic controllable bond. The adhesive tape maintains strong bonding during normal operation (first and third sections), but allows controlled disassembly when needed (through stretching the second section). This dynamic behavior enables the system to adapt between reliability mode and reworkability mode, resolving the contradiction between component stability and reworkability.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The adhesive tape is pre-configured with a release mechanism (the stretchable second section) that enables future disassembly. This preliminary action of incorporating the release layer during assembly ensures that reworkability is built into the structure from the beginning, allowing strong bonding during operation while maintaining the capability for easy disassembly when rework is needed.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the positioning of components, reduces disassembly difficulty, minimizes damage, and enhances the repairability and reusability of electronic devices, facilitating a more efficient recycling process.

Implementation Method 1

stretching the predetermined region to at least partially reduce an adhesiveness of the first section of the at least one stretch release adhesive tape

Methodology Applied
Scientific EffectAdhesiveness reduction through stretching: Deformation

Data Source

PatentUS20260076014A1Electronic device and reworking method for the electronic device
Publication Date: 2026.03.12 AU OPTRONICS CORP
  • US20260076014A1 patent drawing
  • US20260076014A1 patent drawing
  • US20260076014A1 patent drawing

AI summary

An electronic device includes a light emitting module having a light source module, a back frame configured to support the light source module, at least one stretch release adhesive tape, and a circuit substrate. The back frame has at least one through hole. The at least one stretch release adhesive tape is divided into a first section and a second section along an extending direction, and passes through the at least one through hole to be folded, such that the first section and the second section are respectively located on different sides of the at least one through hole and attached on different surfaces of the back frame facing different directions. At least a portion of the first section adheres and bonds the light source module and the back frame, and at least a portion of the second section adheres and bonds the back frame and the circuit substrate.