Stretchable Circuit Board Lamination for Leak-Resistant Fluid Vias
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Solution Overview
Problem
Existing methods for manufacturing stretchable circuit boards face issues with fluid leakage and interface fractures due to insufficient close contact properties between the stretchable insulating layer and the metal foil or sealing film, leading to breakage and increased resistance during elongation.
Innovation Solution
A manufacturing method involving a laminate of a metal layer and stretchable insulating layers with controlled peel strength (0.5 N/mm to 3.0 N/mm) and via formation for encapsulating a fluid, followed by patterning the metal layer to form a stretchable circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid metal is sealed in the substrate with a sealing film, then the stretchable circuit board can be formed, but fracture occurs between the stretchable insulating layer and the sealing film causing liquid metal leakage
Solution Approach 1:
The patent introduces a specific interface structure between the stretchable insulating layer and the sealing film that acts as an intermediary to improve bonding. The interface is designed with controlled peel strength (0.5-3.0 N/mm) to prevent fracture during stretching while maintaining reliable sealing of the liquid metal.
Solution Approach 2:
The patent optimizes the peel strength parameter of the interface between the stretchable insulating layer and the sealing film to a specific range (0.5-3.0 N/mm). This parameter control ensures that the interface can withstand stretching forces without fracturing, thereby preventing liquid metal leakage while maintaining reliability.
2Reliability
If grooves are formed in the stretchable insulating layer and metal foil is laminated to encapsulate fluid, then the circuit board structure is formed, but fracture occurs between the stretchable insulating layer and the metal foil due to insufficient close contact properties
Solution Approach 1:
The patent introduces an adhesive layer or modifies the interface between the stretchable insulating layer and the metal foil to act as an intermediary that improves close contact properties. This intermediary structure ensures reliable bonding that prevents fracture during stretching, thereby preventing fluid leakage from the encapsulated grooves.
Solution Approach 2:
The patent optimizes the peel strength parameter of the interface between the stretchable insulating layer and the metal foil to a specific range (0.5-3.0 N/mm). This parameter control ensures that the interface maintains sufficient close contact properties to prevent fracture during stretching, thereby ensuring fluid leakage prevention.
3Strength
If the peel strength between metal layer and stretchable insulating layer is increased, then the close contact properties are improved, but the interface becomes too rigid causing fracture during stretching
Solution Approach 1:
The patent optimizes the peel strength parameter to a specific range (0.5-3.0 N/mm) that balances close contact properties with stretching flexibility. This parameter optimization ensures that the interface is strong enough to prevent delamination but flexible enough to accommodate stretching without fracturing, thereby maintaining reliability during deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses fluid leakage and reduces interface fractures, ensuring high followability and flexibility of the circuit board without significant resistance changes during deformation.
Implementation Method 1
the stretchable insulating layer contains a thermosetting resin
Data Source
AI summary
A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.