Stretchable Circuit Substrate With Stress-Absorbing Pattern Areas

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Solution Overview

Problem

Flexible display devices face reliability issues due to stress-induced de-filming of electronic components when folded or bent, affecting the adhesion and performance of circuit boards.

Innovation Solution

A stretchable circuit board design featuring a substrate with pattern parts in ineffective areas to absorb stress, preventing the adhesive member from de-filming and maintaining adhesion during stretching and restoration, while the wiring electrodes are formed in a curved shape to withstand deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the circuit board is made flexible to enable folding and bending, then the portability and display flexibility are improved, but the adhesion of electronic components deteriorates due to stress-induced de-filming

Engineering Contradiction:
ImproveflexibilityVSAvoidadhesion
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The substrate is divided into effective area (with electronic components) and ineffective area (without electronic components). Pattern parts are selectively formed only in the ineffective area, allowing stress absorption without affecting component adhesion zones. This segmentation resolves the contradiction by localizing flexibility enhancement away from critical adhesion regions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are given different properties: the ineffective area contains pattern parts for stress absorption and flexibility, while the effective area maintains solid structure for component adhesion. This local differentiation allows the circuit board to be flexible where needed while maintaining reliability where components are bonded.

Inventive Principle:
Principle #3Local quality

2Area of moving object

If the circuit board is stretched to increase display area, then the image display region is improved, but the electronic components are de-filmed due to stress on soldering and bonding areas

Engineering Contradiction:
Improvedisplay areaVSAvoidcomponent bonding
Core Design Contradiction:
Area of moving objectVSReliability

Solution Approach 1:

The substrate is divided into effective area (with electronic components) and ineffective area (without electronic components). Pattern parts are selectively formed only in the ineffective area, allowing stress absorption without affecting component adhesion zones. This segmentation resolves the contradiction by localizing flexibility enhancement away from critical adhesion regions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The pattern parts act as intermediary elements that absorb and distribute stretching stress before it reaches the electronic components. These pattern parts serve as a buffer zone that mediates between the stretching force and the vulnerable soldering/bonding areas, preventing direct stress transmission that causes de-filming.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Stability of the object's composition

If the circuit board is made rigid to maintain structural stability, then the structural integrity is improved, but the ability to fold and bend is reduced

Engineering Contradiction:
Improvestructural integrityVSAvoidfoldability
Core Design Contradiction:
Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The substrate is divided into effective area (with electronic components) and ineffective area (without electronic components). Pattern parts are selectively formed only in the ineffective area, allowing stress absorption without affecting component adhesion zones. This segmentation resolves the contradiction by localizing flexibility enhancement away from critical adhesion regions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate incorporates pattern parts that create a flexible structure capable of folding and bending while maintaining overall structural integrity. The patterned design allows the substrate to function as a flexible shell that can deform without compromising the stability of the effective area where components are mounted.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the reliability of flexible display devices by preventing adhesion deterioration and maintaining electronic component bonding, even when the circuit board is repeatedly stretched and restored.

Implementation Method 1

the substrate includes an effective area in which the electronic component is formed and an ineffective area other than the effective area, the substrate is formed with a pattern part passing through the one surface and the other surface of the substrate, and the pattern part is formed in the ineffective area

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

it is possible to prevent an adhesive member disposed on the effective area from being de-filmed by stretching

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 3

when the substrate is stretched and restored, a wiring electrode may also be stretched and restored by forming the wiring electrode connecting the electronic component in a curved shape including a peak and a trough

Methodology Applied
Scientific EffectGeometric deformation resistance: Geometry

Data Source

PatentUS11877393B2Stretchable circuit substrate
Publication Date: 2024.01.16 LG INNOTEK CO LTD
  • US11877393B2 patent drawing
  • US11877393B2 patent drawing
  • US11877393B2 patent drawing

AI summary

A stretchable circuit board according to an embodiment comprises: a substrate including one surface and the other surface opposite to the one surface; an electronic component disposed on the one surface of the substrate; and a wiring electrode disposed on the one surface of the substrate and connecting the electronic component, wherein the substrate includes an effective area, in which the electronic component is formed, and an ineffective area other than the effective area and includes a pattern part which is formed in the ineffective area and extends through the substrate from one surface to the other surface thereof.