Stretchable Display Connection Line Adhesion

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Solution Overview

Problem

Stretchable display devices face reliability issues due to peeling and delamination of connection lines between adjacent circuits during stretching, leading to potential breakage and damage to thin film transistors, capacitors, and connection lines.

Innovation Solution

The solution involves reducing the steepness of the slope in the insulating layer in contact with connection lines, filling undercut portions in the substrate with an overcoating layer, and ensuring contact points of connection lines are disposed on protruding portions of a substrate to enhance stability and prevent peeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If connection lines are formed on a flexible substrate that can be stretched, then the display device achieves flexibility and deformability, but peeling and delamination of connection lines occur during stretching

Engineering Contradiction:
ImproveflexibilityVSAvoidpeeling resistance
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The substrate is divided into a flexible lower substrate and multiple rigid individual substrates. The connection lines are formed on the rigid individual substrates rather than directly on the flexible lower substrate, segmenting the structure to prevent peeling while maintaining overall flexibility.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Rigid individual substrates serve as intermediary elements between the flexible lower substrate and the connection lines. These intermediaries protect the connection lines from direct stress during stretching, preventing peeling and delamination while allowing the display device to maintain flexibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If the insulating layer has a steep slope in step, then manufacturing is simplified, but connection lines peel from the insulating layer during repeated stretching

Engineering Contradiction:
Improveinsulating layer formationVSAvoidadhesion strength
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The slope angle of the insulating layer step is changed from steep to gentle. This parameter modification improves adhesion strength and prevents peeling of connection lines during repeated stretching, while still allowing for practical manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If connection lines transition over an undercut portion, then substrate manufacturing is achieved, but connection lines are prone to breakage

Engineering Contradiction:
Improvesubstrate formationVSAvoidconnection line integrity
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The undercut portion is filled with an overcoating layer before the connection lines are formed. This preliminary action creates a smooth, gradual slope that supports the connection lines, preventing breakage while still allowing for standard substrate manufacturing processes.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The overcoating layer serves as an intermediary material that fills the undercut portion and provides a smooth transition surface for the connection lines. This intermediary structure eliminates the sharp edges that would cause stress concentration and breakage.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12217636B2Stretchable display device
Publication Date: 2025.02.04 LG DISPLAY CO LTD
  • US12217636B2 patent drawing
  • US12217636B2 patent drawing
  • US12217636B2 patent drawing

AI summary

In the stretchable display device of the present disclosure, peeling and delamination of connection lines between adjacent circuits mounted on individual fixed substrates that might occur during stretching is reduced. According to one embodiment a temporary substrate is formed having a plurality of stiff areas and an elastic area, the temporary substrate being on a subsidiary substrate. A plurality of individual substrates are disposed on the lower substrate and located in the active area on the lower substrate. A first inorganic layer is formed on each of the plurality of individual substrates, the first inorganic layer having a sidewall surface extending upward from the first substrate. An organic layer is deposited overlying the first inorganic layer, including overlying the sidewall surface of the first inorganic layer.