Stretchable Electronic Package With Elastomer Encapsulation
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Solution Overview
Problem
Current electronic device packages are typically rigid, limiting their ability to conform to various contours and applications, and existing flexible solutions either provide bendability or stretchability but not both simultaneously.
Innovation Solution
A bendable and thin die is embedded in elastomer materials and connected to stretchable interconnects, allowing for the creation of a flexible electronic package that can be both bendable and stretchable, with processes for wafer and panel-level manufacturing that include encapsulation and attachment methods like wire bonding and solder attach to ensure durability and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If electronic device packages are made rigid, then structural stability is improved, but flexibility and ability to conform to various contours deteriorates
Solution Approach 1:
The patent employs flexible substrate materials and thin-film encapsulation layers to create electronic packages that can bend and conform to various surfaces. The use of flexible printed circuit boards (FPCBs) and thin dielectric films enables the package to maintain structural integrity while achieving the required flexibility for wearable applications.
Solution Approach 2:
The patent utilizes composite material structures combining rigid and flexible components. The electronic package integrates rigid semiconductor devices with flexible interconnects, substrates, and encapsulation materials, creating a hybrid structure that balances structural stability with adaptability to curved surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of wearable electronic systems that can conform to curved surfaces while providing protection from environmental influences and maintaining biocompatibility, offering enhanced functionality beyond simple temperature sensing with improved manufacturability and scalability.
Implementation Method 1
A bendable and thin die is embedded in elastomer materials and connected to stretchable interconnects
Data Source
AI summary
Generally discussed herein are systems and methods that can include a stretchable and bendable device. According to an example a method can include (1) depositing a first elastomer material on a panel, (2) laminating trace material on the elastomer material, (3) processing the trace material to pattern the trace material into one or more traces and one or more bond pads, (4) attaching a die to the one or more bond pads, or (5) depositing a second elastomer material on and around the one or more traces, the bonds pads, and the die to encapsulate the one or more traces and the one or more bond pads in the first and second elastomer materials.