Stretchable Electronic Device with Grooved Insulation for Crack Resistance

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Solution Overview

Problem

Stretchable electronic devices are prone to cracking or damage when deformed, affecting their lifespan due to substrate failure under stress.

Innovation Solution

Incorporating a first insulating structure with grooves and protruding portions in the substrate design to reduce crack propagation and enhance structural integrity during deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the substrate is made stretchable to enable device flexibility, then adaptability to curved surfaces is improved, but substrate cracking and damage occur during deformation

Engineering Contradiction:

Improveadaptability to curved surfacesVSAvoidsubstrate cracking resistance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The substrate is divided into multiple main structures (first main structure, second main structure) connected by connecting structures. This segmentation allows each main structure to move independently during deformation, reducing stress concentration and preventing substrate cracking while maintaining stretchability for curved surface adaptation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs flexible substrate structures including insulating structures with grooves and protruding portions that can deform elastically. These flexible thin film structures accommodate stretching and bending without cracking, enabling the device to adapt to curved surfaces while maintaining structural integrity and reliability.

Inventive Principle:

Principle #30Flexible shells and thin films

2Ease of manufacture

If the substrate structure is simplified to reduce manufacturing complexity, then ease of manufacture is improved, but crack propagation resistance deteriorates

Engineering Contradiction:

Improvesubstrate structure complexityVSAvoidcrack propagation resistance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The substrate is segmented into main structures and connecting structures, with insulating structures containing grooves. This segmentation creates multiple small regions that can deform independently, preventing crack propagation across the entire substrate. The segmented design achieves crack resistance without significantly complicating the manufacturing process.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The insulating structures are designed with local features (grooves and protruding portions) specifically at critical locations where stress concentration occurs. This local quality enhancement provides crack propagation resistance at key points without requiring complex modifications throughout the entire substrate structure, maintaining ease of manufacture.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12414237B2Electronic device

Publication Date: 2025.09.09 INNOLUX CORP

AI summary

An electronic device is provided by the present disclosure. The electronic device includes a first main structure, a second main structure adjacent to the first main structure, a connecting structure connecting the first main structure and the second main structure, a first semiconductor disposed on the first main structure and a first insulating structure disposed between the first semiconductor and the first main structure, wherein the first insulating structure has a first groove.