Stretchable Electronics Interconnects for Extreme Strain
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Solution Overview
Problem
Current stretchable electronics are limited in their ability to accommodate extreme stretchability, which restricts their application in mechanically unconstrained environments.
Innovation Solution
The development of extremely stretchable electrical interconnects using thin membrane single crystal semiconductors formed into 'islands' connected by highly compliant interconnects, which are transferred onto an elastomeric substrate, allowing for high translational and rotational strains while maintaining electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If single crystal semiconductor materials are used for integrated circuits, then high electrical performance is achieved, but the materials become brittle and cannot withstand strains greater than about +/- 2%
Solution Approach 1:
The patent divides the semiconductor structure into discrete device islands separated by trenches, allowing the rigid semiconductor regions to be isolated from mechanical strain. The interconnect bridges spanning the trenches accommodate strain through geometric deformation while the islands themselves experience minimal strain, resolving the contradiction between maintaining electrical performance and withstanding mechanical deformation.
Solution Approach 2:
The patent introduces an intermediate elastomeric substrate that mediates between the rigid semiconductor devices and the external mechanical environment. This compliant substrate absorbs and distributes mechanical strain, preventing direct transmission of stress to the brittle semiconductor materials while allowing the overall system to be stretched and deformed.
2Reliability
If rigid interconnects are used to connect device islands, then electrical connections are stable, but the structure cannot accommodate large translational and rotational strains
Solution Approach 1:
The patent transforms the interconnect structure from a rigid static configuration to a dynamic geometric pattern that can adapt its shape in response to mechanical deformation. The serpentine and grid patterns are designed to deform elastically under strain, allowing the interconnect to accommodate large displacements and rotations while maintaining continuous electrical pathways between device islands.
3Adaptability or versatility
If thin membrane single crystal semiconductors are formed into islands and transferred onto elastomeric substrates, then extreme stretchability is achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent performs preliminary fabrication of device islands and interconnect structures on a rigid semiconductor substrate where precise patterning and alignment can be achieved using standard semiconductor manufacturing techniques. After the structures are fully formed and tested, the entire array is released and transferred as a complete unit to the elastomeric substrate, consolidating complex manufacturing steps into a preliminary phase before the final flexible assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables electronics to withstand strains of up to -100,000% to +100,000% and rotations greater than 180°, maintaining electrical integrity and functionality, thereby expanding the range of applications for stretchable electronics.
Implementation Method 1
The underlying elastomeric substrate is much more compliant than the islands, so that minimal strain is transferred into the islands while the majority of the strain is transferred to the interconnects
Data Source
AI summary
A stretchable electrical interconnect, comprising an electrical interconnect for connecting two electrical contacts, said electrical interconnect arranged boustrophedonicially to define rungs between said contacts, said rungs being substantially parallel with one another, and a plurality of said rungs having substantially the same length and displacement therebetween, wherein the ratio of said length of said plurality of said rungs and said displacement between said plurality of said rungs is at least 10:1.