Stretchable Electronic Laminate With Crimped Conductive Layers
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Solution Overview
Problem
Existing methods for producing stretchable electronic devices face issues such as base material deformation during reflow soldering, limiting substrate material selection and leading to defective component mounting.
Innovation Solution
A laminate production method involving lamination of a resin film with a conductive layer on a base material using an adhesive layer, followed by crimping to electrically connect conductive layers, thereby omitting reflow soldering and allowing for a wider range of substrate materials and reducing defective mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflow soldering is performed to mount components on stretchable base material, then component mounting is achieved, but the base material melts or deforms due to high temperature
Solution Approach 1:
The patent introduces a flexible printed circuit board (FPC) as an intermediary carrier between the component and the stretchable base material. The FPC has a rigid structure that can withstand reflow soldering temperatures, allowing components to be mounted on it first. The FPC is then attached to the stretchable base material, enabling the component to be indirectly mounted without exposing the base material to high temperatures that would cause melting or deformation.
2Reliability
If heat resistant material is used as base material to withstand reflow soldering, then component mounting becomes possible, but selection of stretchable base material is limited
Solution Approach 1:
The patent divides the device into separate functional segments: the stretchable base material layer and the FPC carrier layer. The FPC serves as a dedicated component mounting platform that can be made from heat-resistant materials, while the base material can be selected independently for stretchability and other desired properties without being constrained by heat resistance requirements. This segmentation allows each layer to be optimized for its specific function.
3Ease of manufacture
If component is directly mounted on stretchable base material, then manufacturing process is simplified, but defective mounting occurs due to base material deformation
Solution Approach 1:
The FPC acts as an intermediary carrier that provides a stable, non-deforming surface for component mounting. By mounting components on the FPC rather than directly on the stretchable base material, the patent eliminates the deformation issues that would lead to defective mounting. The FPC maintains its structural integrity during the manufacturing process, ensuring precise component placement while still allowing the overall device to be manufactured in a relatively simple manner.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and reliable production of stretchable electronic devices without reflow soldering, allowing for separate processing of stretchable and mounting portions, and eliminating the need for via processing or plating, resulting in a highly reliable laminate.
Implementation Method 1
with an adhesive layer interposed therebetween
Implementation Method 2
by performing crimping on at least one of before and after the lamination
Data Source
AI summary
One aspect of the present invention relates a method for producing a laminate for an electronic device including laminating a resin film having a conductive layer (B) on at least one surface thereof on a surface of a base material having a conductive layer (A) with an adhesive layer interposed therebetween, and electrically connecting at least two conductive layers among the conductive layers by performing crimping on at least one of before and after the lamination.