Stretchable Laminate Bubble-Free Curing via Organic Peroxide Control
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Solution Overview
Problem
Existing substrate materials for electronic equipment lack stretchability and are prone to bubble formation during curing, leading to poor appearance and defects like pinholes when conductive layers are applied.
Innovation Solution
A stretchable laminate comprising a resin layer with a cured product of a resin composition including an organic peroxide, sandwiched between two substrates, with specific tensile stress and elongation at break properties, and controlled bubble and opening formation on its surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin composition including an organic peroxide is used for curing, then the resin layer achieves proper curing and crosslinking, but bubbles and openings are generated during curing leading to poor appearance and pinholes
Solution Approach 1:
The patent converts the harmful effect of organic peroxide decomposition into a beneficial process by controlling the decomposition conditions. The organic peroxide is decomposed at a controlled rate during the curing process, and the decomposition temperature is set to 50°C or higher to prevent premature bubble formation while ensuring complete curing. This transforms the potential harm of peroxide decomposition into a controlled curing mechanism that eliminates bubbles.
Solution Approach 2:
The patent changes the curing temperature parameter to 50°C or higher, which fundamentally alters the decomposition behavior of the organic peroxide. At this temperature range, the peroxide decomposes controllably without generating excessive gas pressure that would form bubbles. This parameter change transforms the curing process from a bubble-generating reaction into a controlled crosslinking process.
2Adaptability or versatility
If the resin layer is made stretchable with flexibility, then the laminate can be deformed and bent, but the material lacks structural stability
Solution Approach 1:
The patent creates a composite structure by combining a resin layer with specific mechanical properties (tensile stress of 0.5-10 MPa at 50% elongation and elongation at break of 50-700%) with substrate layers. This composite laminate structure allows the resin layer to provide stretchability and flexibility while the substrate layers provide structural stability, achieving both adaptability and stability simultaneously.
Solution Approach 2:
The patent specifies precise mechanical property parameters for the resin layer: tensile stress of 0.5 MPa or more and 10 MPa or less at 50% elongation, and elongation at break of 50% or more and 700% or less. By controlling these parameters, the resin layer achieves optimal balance between flexibility and structural integrity, enabling stretchability while maintaining stability.
3Object-generated harmful factors
If bubbles or openings are present on the surface, then the appearance is poor, but also defects such as pinholes occur when applying conductive layers
Solution Approach 1:
The patent eliminates the harmful effect of bubble formation by controlling the organic peroxide decomposition temperature to 50°C or higher. This prevents gas generation during curing, thereby eliminating bubbles and openings on the surface. The result is a bubble-free surface that ensures both good appearance quality and manufacturing precision for subsequent conductive layer application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate achieves flexibility and stretchability while minimizing bubbles and openings, preventing defects in conductive layers and enhancing the appearance and reliability of electronic devices.
Implementation Method 1
a resin layer (A); a first substrate (B); and a second substrate (C), wherein the resin layer (A) includes a cured product of a resin composition including an organic peroxide
Implementation Method 2
a cured product of a resin composition including an organic peroxide
Implementation Method 3
heating these under pressurization
Implementation Method 4
heating these under pressurization, wherein a pressure during the pressurization is 0.3 MPa or more and 10 MPa or less
Implementation Method 5
the resin layer (A) has a tensile stress of 0.5 MPa or more and 10 MPa or less at 50% elongation, and an elongation at break of 50% or more and 700% or less
Data Source
AI summary
The present invention relates to a stretchable laminate that is a laminate including: a resin layer (A); a first substrate (B); and a second substrate (C), wherein the resin layer (A) includes a cured product of a resin composition including an organic peroxide, the resin layer (A) is located between the first substrate (B) and the second substrate (C), the resin layer (A) has a tensile stress of 0.5 MPa or more and 10 MPa or less at 50% elongation, and an elongation at break of 50% or more and 700% or less, and when a surface of the resin layer (A) is observed with an optical microscope, a total number of bubbles and openings having a diameter of 150 to 500 μm is 5 per 10 cm2 or less, and bubbles and openings having a diameter exceeding 500 μm are not present.