Stretchable Flexible Electronic Module With Segmented Substrate

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Solution Overview

Problem

Conventional electronic devices manufactured on rigid carriers face limitations in flexibility, making them unsuitable for applications requiring stretchability, such as being worn by users or attached to curved surfaces, as they can only be bendable but not stretchable.

Innovation Solution

A flexible electronic module comprising a patterned flexible substrate with distributed regions and a stretchable material layer, where the stretchable material layer connects the distributed regions, allowing the module to stretch and increase its applicability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electronic devices are manufactured on a rigid carrier, then electrical quality stability and reliability are improved, but flexibility and applicability are worsened

Engineering Contradiction:

Improveelectrical quality stabilityVSAvoidflexibility and applicability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The rigid carrier is segmented into distributed regions that are separated by stretchable material layers, allowing the conductive wires to be divided into segments that can independently deform while maintaining electrical connectivity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses composite structures combining rigid carrier regions with flexible stretchable material layers, creating a hybrid system that exhibits both structural support and deformability characteristics

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If flexible electronic products are manufactured, then applicability is improved, but stretchability is worsened (products can be bendable but not stretchable)

Engineering Contradiction:

ImproveapplicabilityVSAvoidstretchability

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent employs stretchable material layers as flexible thin films that can be stretched and deformed, replacing traditional rigid encapsulation layers and enabling the electronic products to achieve stretchability while maintaining structural integrity

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent introduces dynamic deformability to the electronic product structure, allowing the conductive wires and substrate to change shape and size dynamically through the stretchable material layers, enabling the product to adapt to various stretching conditions

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS10098225B2Flexible electronic module and manufacturing method thereof

Publication Date: 2018.10.09 IND TECH RES INST

AI summary

A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.