Stretchable Semiconductor Packages with Warped Chips
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Solution Overview
Problem
Current semiconductor packages lack stretchability, making it difficult to realize semiconductor chips that can extend or bend with external forces, which is essential for flexible and wearable electronic systems.
Innovation Solution
A stretchable semiconductor package design featuring an extendible molding member with a warped semiconductor chip and connectors, where the molding member is made of flexible materials like polydimethylsiloxane (PDMS) or poly-ethylene-terephthalate (PET), allowing the chip to straighten or warp in response to tensile forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the molding member is made of rigid materials to maintain structural integrity, then the package is stable, but the package cannot warp or bend when external forces are applied
Solution Approach 1:
The patent replaces rigid molding materials with flexible molding materials that can warp and bend when external forces are applied. This flexible molding material maintains structural integrity through its elastic properties while enabling the package to adapt to curved surfaces and undergo controlled deformation.
Solution Approach 2:
The patent employs composite material structures that combine different material properties to achieve both structural integrity and warping capability. The composite design allows the package to maintain stability while being capable of bending and warping in response to external forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of semiconductor packages that can stretch or warp, maintaining electrical connectivity and enhancing the flexibility and durability of semiconductor devices for portable and wearable electronics.
Implementation Method 1
the molding member is made of flexible materials like polydimethylsiloxane (PDMS) or poly-ethylene-terephthalate (PET), allowing the chip to straighten or warp in response to tensile forces
Data Source
AI summary
A semiconductor package includes a molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. The molding member includes an extendible material which includes a first part having a warped shape, a second part extending from one end of the first part to be flat, and a third part extending from the other end of the first part to be flat, where first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip.