Stretchable Silicon Sensor Networks for Structural Health Monitoring
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Solution Overview
Problem
Existing sensor networks for structural health monitoring face challenges in scalability, manufacturability, mechanical connection of signals, reliability of wiring and fiber-optic harnesses, power busses, and data busses, particularly in addressing arrays of sensors without complex interconnections.
Innovation Solution
A method and system utilizing stretchable silicon substrates with integrated conductive paths to form networks, including energy harvesting and storage elements, communication devices, and sensors, where zinc oxide nanowires are used for power generation and wireless communication capabilities, enabling redundant interconnections and autonomous operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If fiber optic communications is used for sensor networks, then low power devices are enabled, but complexity of interconnections among network nodes increases
Solution Approach 1:
The patent combines multiple functions (sensing, communication, power management, signal processing) into integrated sensor nodes that are directly connected through simple wiring harnesses, eliminating the need for complex interconnection protocols while maintaining low power operation through integrated power management circuits
Solution Approach 2:
The sensor nodes are designed as universal modules that can perform multiple functions (sensing, wireless communication, wired communication, power harvesting, signal processing) within a single integrated unit, reducing the need for specialized components and complex interconnections
2Reliability
If wired sensor networks are used for structural health monitoring, then reliable signal transmission is achieved, but weight and complexity of wiring harnesses increases
Solution Approach 1:
The patent merges wired and wireless communication capabilities into the same sensor node, allowing reliable data transmission through wired connections when needed while enabling wireless communication to reduce wiring requirements in other scenarios, thereby reducing overall wiring harness weight
Solution Approach 2:
The patent employs flexible printed circuit boards and thin-film conductive traces for wiring connections, significantly reducing the weight and flexibility of wiring harnesses while maintaining reliable signal transmission through the flexible connections
3Device complexity
If arrays of sensors are addressed without complex interconnections, then device complexity is reduced, but manufacturability and scalability are challenged
Solution Approach 1:
The patent segments the sensor network into standardized, modular sensor nodes that can be independently manufactured and then assembled into arrays, simplifying the manufacturing process while maintaining simple interconnections through uniform connection interfaces
Solution Approach 2:
The patent utilizes flexible substrate materials that can be stretched and deformed during manufacturing to create conductive pathways and interconnections, enabling simple wiring harness designs that are easy to manufacture while maintaining reliability across large sensor arrays
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable, scalable, and cost-effective sensor networks that can monitor large areas, including structural health, with reduced complexity and weight, capable of withstanding harsh environments and efficiently managing data from diverse sensors.
Implementation Method 1
The at least one power supply node includes a piezo-electric generator that is integrated with silicon-based Nano/Micro-Electromechanical Systems (N/MEMS)
Data Source
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AI summary
A sensor network is described which includes a stretchable silicon substrate, and a plurality of nodes fabricated on the stretchable silicon substrate. The nodes include at least one of an energy harvesting and storage element, a communication device, a sensing device, and a processor. The nodes are interconnected via interconnecting conductors formed in the substrate.