Stretchable Substrate Via with Buffer Shell

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Solution Overview

Problem

Conventional stretchable electronic substrates face challenges in forming vias due to complex manufacturing processes and delamination issues when subjected to stretching forces, leading to increased electrical resistance.

Innovation Solution

A method involving the use of conductive particles and a curable resin, where the particles are arranged using a magnetic field to form a via, with a buffer shell having a higher Young's modulus than the substrate but lower than the via, to maintain structural integrity and stability under stretching forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a physical hole is formed and metal thin film is filled to create a via, then electrical connection between surfaces is achieved, but the manufacturing process becomes very complicated and manufacturing costs increase significantly

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the conventional mechanical approach of forming physical holes and filling metal thin films with a magnetic field-based approach. Conductive particles are arranged using a magnetic field to form the via structure, eliminating the need for complex mechanical drilling and filling processes while maintaining electrical connectivity between substrate surfaces.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and arrangement method of conductive materials. Instead of using solid metal thin films deposited through complex processes, the invention uses conductive particles that can be manipulated and arranged in desired patterns through magnetic field application, fundamentally changing the manufacturing parameter from mechanical deposition to magnetic field control.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a metal thin film is used to form a via, then electrical connection is provided, but delamination occurs when stretching force is applied due to Young's modulus mismatch between the metal thin film and stretchable substrate

Engineering Contradiction:

Improveelectrical connectionVSAvoidbonding stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent changes the material parameter of the via structure from rigid metal thin film to flexible conductive particles embedded in elastomer. This parameter change allows the via to match the mechanical properties of the stretchable substrate, preventing delamination under stretching forces while maintaining electrical connectivity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite via structure consisting of conductive particles embedded within an elastomer matrix. This composite material combines the electrical conductivity of the particles with the flexibility and elasticity of the elastomer, enabling the via to withstand stretching forces without delamination while maintaining electrical connection.

Inventive Principle:

Principle #40Composite materials

3Reliability

If a metal thin film forms the via, then electrical connection is achieved, but electrical resistance changes significantly when stretching force is applied due to Young's modulus difference

Engineering Contradiction:

Improveelectrical connectionVSAvoidelectrical resistance stability

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the mechanical parameter of the via material from rigid (metal thin film with high Young's modulus) to flexible (conductive particles in elastomer with low Young's modulus). This parameter change ensures that the via maintains its electrical resistance stability under stretching forces by matching the substrate's mechanical properties, preventing resistance fluctuations.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution prevents delamination and maintains low electrical resistance changes even under large stretching forces, ensuring reliable operation of electronic devices on the stretchable substrate.

Implementation Method 1

forming a material layer, which has stretchability by curing

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Implementation Method 2

disposing a mixture of conductive particles which move due to a magnetic field

Methodology Applied

Scientific EffectMagnetic field effect: Magnetic Field

Data Source

PatentUS11284509B2Method for forming flexible substrate including via, and flexible substrate having via

Publication Date: 2022.03.22 SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

AI summary

Disclosed is a stretchable substrate including: a via configured to provide an electrical connection between one surface and the other surface of the stretchable substrate; and a buffer shell positioned between the via and the stretchable substrate and having a Young's modulus value that is greater than a Young's modulus value of the stretchable substrate and smaller than a Young's modulus value of the via.