Stretchable Wiring Raised Structure for Crack-Resistant Lamination
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Solution Overview
Problem
Stretchable devices with laminated structures face issues of reduced reliability due to cracks and disconnections in thin stretchable wirings caused by expansion and contraction, which are not adequately addressed in existing technologies.
Innovation Solution
The stretchable device incorporates a stretchable wiring with a raised region on at least one wiring main surface, increasing thickness locally to enhance strength and adhesion with the substrate, thereby reducing the likelihood of cracks and disconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the stretchable wiring is reduced to achieve excellent stretchability and reduced device height, then the stretchability and wearing feeling are improved, but the reliability deteriorates due to increased likelihood of cracks and disconnections
Solution Approach 1:
The patent applies local quality by creating a raised region at a specific location on the wiring main surface. This raised region has greater thickness than the surrounding areas, providing enhanced strength and crack resistance precisely where needed (such as at connection points or high-stress areas), while the rest of the wiring maintains its thin profile for optimal stretchability. This localized thickening resolves the contradiction by improving reliability without compromising overall stretchability.
Solution Approach 2:
The patent introduces a dimensional variation by forming a raised region that protrudes in the thickness direction (lamination direction) of the wiring. This creates a three-dimensional structure with different height levels on the wiring surface, allowing the wiring to have both thin overall thickness for stretchability and localized increased thickness for reliability. The raised region adds a vertical dimension to the otherwise planar wiring structure.
2Length of stationary object
If the thickness of the stretchable wiring is reduced to minimize device height, then the wearing feeling is improved, but the adhesion strength with the substrate is reduced
Solution Approach 1:
The raised region provides localized increased thickness and surface area at the wiring-substrate interface, enhancing adhesion strength precisely where the wiring contacts the substrate. This local quality improvement allows the overall device height to remain minimal while ensuring sufficient bonding area for reliable adhesion at critical contact points.
Solution Approach 2:
The raised region extends in the thickness direction (lamination direction), adding a vertical dimension to the wiring structure. This dimensional change increases the contact area between the wiring and substrate in the thickness direction, thereby improving adhesion strength without significantly increasing the overall device height, as the raised region is confined within the existing thickness envelope.
Data Source
AI summary
A stretchable device including: a laminated body having a plurality of stretchable substrates; and a stretchable wiring arranged inside the laminated body. The stretchable wiring includes two wiring main surfaces facing each other in a lamination direction of the stretchable substrate. In a sectional view, at least one of the wiring main surfaces includes a first region and a second region. The first region is a region in which a part of the wiring main surface is raised in the lamination direction more than that of the second region.