Semiconductor Strip Carrier Assembly for Warpage Control

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Solution Overview

Problem

Conventional semiconductor package strip carriers fail to effectively control warpage during transport and manufacturing processes, leading to damage and reduced wafer yield due to thermal expansion mismatches and material properties.

Innovation Solution

A carrier assembly with a housing and clamping devices that apply compressive forces to semiconductor package strips using strip contacting extensions and a locking mechanism, reducing warpage by pressing the strips against supporting slots, especially during pre-baking and post-curing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional magazines are used to carry package strips, then the strips can be transported between processes, but the strips are subject to damage and warpage during transport and manufacturing

Engineering Contradiction:

Improvestrip integrityVSAvoidwarpage and damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by pre-baking the package strips before molding to eliminate moisture and prevent delamination. The encapsulant is also pre-positioned in the magazine, and the strips are pre-aligned in supporting slots to prevent damage during transport and processing

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary mechanism - a clamping device with movable clamps that actively secure the package strips during transport and processing. This intermediary system prevents direct contact between strips and potentially damaging surfaces, reducing warpage and damage

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If heat is applied to eliminate moisture and avoid delamination, then the strips can be protected from delamination risks, but the strips warp due to thermal expansion mismatches

Engineering Contradiction:

Improvedelamination resistanceVSAvoidstrip warpage

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The patent applies parameter changes by carefully controlling the temperature profile during pre-baking to balance moisture removal with warpage minimization. The heating process is optimized to achieve delamination prevention while maintaining acceptable strip flatness for subsequent molding

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent performs preliminary pre-baking to remove moisture before the molding process, preventing delamination during encapsulation. This preliminary thermal treatment prepares the strips for molding while the clamping device subsequently controls any warpage that develops

Inventive Principle:

Principle #10Preliminary action

3Shape

If the strips are securely clamped to control warpage, then the warpage can be reduced during processing, but the device complexity increases with clamping mechanisms

Engineering Contradiction:

Improvewarpage controlVSAvoidcarrier structure

Core Design Contradiction:

ShapeVSDevice complexity

Solution Approach 1:

The patent applies dynamics by using movable clamps that can be positioned and secured at optimal locations along the strip. The clamping mechanism allows for adjustable positioning to accommodate different strip sizes and warpage conditions, providing effective control without requiring a completely rigid complex structure

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent segments the clamping function into multiple independent clamps that can operate on different portions of the strip. This segmentation allows localized warpage control and simplifies the overall mechanism compared to a single complex rigid clamping system

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces warpage issues, enabling secure transport and processing of semiconductor package strips, allowing for automation in the molding process and improving manufacturing efficiency and cost-effectiveness.

Implementation Method 1

Methodology Applied

Scientific EffectCompressive force: Compression

Implementation Method 2

A carrier assembly with a housing and clamping devices that apply compressive forces to semiconductor package strips using strip contacting extensions and a locking mechanism

Methodology Applied

Scientific EffectMechanical locking: Mechanical Fastener

Data Source

PatentUS20240332050A1Carrier assembly for carrying semiconductor package strips with improved warpage control

Publication Date: 2024.10.03 JCET STATS CHIPPAC KOREA LTD

AI summary

A carrier assembly comprises a carrier main body comprising a housing, the housing comprising side walls having supporting slots for carrying the semiconductor package strips inside the housing, respectively, and the housing defining a front opening and a rear opening between the side walls to allow for placement and displacement of the semiconductor package strips, and a pair of clamping devices for applying clamping forces to the semiconductor package strips against the supporting slots, respectively, and each of the pair of clamping device comprising a locking plate, strip contacting extensions extending from the locking plate and insertable through one of the front opening and the rear opening of the housing, and a locking member for moving the strip contacting extensions between a locked position and an unlocked position, wherein in the locked position the substrate package strips are pressed against the supporting slots by the respective strip contacting extensions.