Strip Lighting Module Opaque Encapsulation Method
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Solution Overview
Problem
Existing lighting devices with elongated strip-shaped designs face challenges in making electronic power supply and driving components invisible while maintaining exposed light emission ends, especially when these components are taller than the light sources, leading to limited light emission source selection and aesthetic issues.
Innovation Solution
A method involving the use of an opaque curable polymeric material to cover electronic power supply and driving components, applied either selectively or continuously, using techniques like pad printing or encapsulating with capsules, ensuring the light emission ends remain exposed even if the components are taller, integrating standard encapsulation techniques and allowing greater freedom in component selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If an opaque encapsulation layer is dispensed to cover electronic components, then aesthetic appearance is improved, but light radiation is blocked when components are taller than light sources
Solution Approach 1:
The patent divides the encapsulation process into multiple stages: first applying a base layer of opaque encapsulant, then selectively adding additional encapsulant only to areas where electronic components protrude beyond the light sources. This segmented approach ensures complete coverage of tall components while preserving light emission paths.
Solution Approach 2:
The patent applies different heights of opaque encapsulation material to different regions of the circuit board. Areas with tall electronic components receive additional encapsulant to match the height of light sources, while areas with shorter components maintain the base layer height. This local differentiation ensures aesthetic uniformity without blocking light radiation.
2Illumination intensity
If electronic components are required to be shorter than light sources to allow light emission, then light distribution is maintained, but component selection is limited
Solution Approach 1:
The patent applies the base layer of opaque encapsulant before final component placement and height equalization. This preliminary encapsulation layer provides a foundation that can be selectively built upon, allowing tall components to be covered without affecting light emission areas. The preliminary action enables greater freedom in component selection while maintaining uniform light distribution.
3Shape
If opaque material is applied to cover electronic components, then visibility of components is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs self-aligning features in the encapsulation process, such as using the profiles of electronic components themselves as guides for where additional encapsulant should be added. The encapsulant naturally flows to fill gaps and cover protruding components, reducing the need for complex masking or precise positioning equipment. This self-service approach simplifies manufacturing while achieving complete component coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for complete coverage of black electronic components without obstructing light emission, offering better aesthetic appearance, lower costs, and improved availability of components and light sources, while maintaining uniform light distribution and flexibility.
Implementation Method 1
dispensing a curable polymeric material into the channel-shaped profile
Implementation Method 2
an opaque curable polymeric material which is dispensed onto the printed circuit and the electronic components
Data Source
Figure 1a~1f
Figure 2a~2f
Figure 3a~3f
AI summary
A method for producing a lighting device, comprising: - providing a strip-shaped lighting module (10) including a printed circuit (12) carrying a plurality of electrically-powered light radiation sources (16) having respective light emitting ends (16a) and a plurality of electronic components (18) protruding from a first face (12a) of said printed circuit (12), wherein said electronic components (18) have respective upper portions (18a) protruding from said printed circuit (12) beyond said light emitting ends (16a) of said electrically-powered light radiation sources (16), - placing said lighting module (10) in a channel-shaped profile (20), with said first face (12a) of the printed circuit (12) facing upwards, - dispensing a first opaque curable polymeric material (22) into said channel-shaped profile (20), in order to cover said printed circuit (12) and leave said light emitting ends (16a) of said electrically-powered light radiation sources (16) and said upper portions (18a) of said electronic components (18) uncovered, and - coating said upper portions (18a) with an opaque coating (24, 30, 32).