Strip-Shaped Compensation Regions in Semiconductor Devices

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Solution Overview

Problem

Semiconductor devices face challenges in improving blocking capability and reducing switching losses due to the extensive compensation of p- and n-doping, which affects the current-carrying area and on-resistance.

Innovation Solution

The semiconductor device incorporates strip-shaped cell and edge compensation regions of a first conductivity type connected by a bridge structure within the edge termination region, allowing for efficient depletion of charge carriers during switch-off and reducing switching losses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If extensive compensation of p- and n-doping is implemented, then blocking capability is improved, but current-carrying area is reduced and on-resistance increases

Engineering Contradiction:
Improveblocking capabilityVSAvoidswitching losses
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The compensation structure is segmented into two distinct parts: cell compensation regions within the cell area and edge compensation regions at the chip edge. This segmentation allows independent optimization of each region's function, enabling the cell region to focus on current conduction while the edge region handles voltage blocking, thereby resolving the contradiction between blocking capability and switching losses.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different doping compensation strategies are applied to different spatial locations: the cell compensation regions use a doping concentration and geometry optimized for maintaining low on-resistance in the current-carrying path, while the edge compensation regions use a different configuration optimized for withstanding high voltages. This local quality differentiation allows simultaneous optimization of both blocking capability and switching performance.

Inventive Principle:
Principle #3Local quality

2Reliability

If extensive compensation of p- and n-doping is implemented, then blocking capability is improved, but current-carrying area is reduced

Engineering Contradiction:
Improveblocking capabilityVSAvoidcurrent-carrying area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The chip area is segmented into cell regions containing compensation structures and inactive edge regions. The cell compensation regions are strategically placed to provide necessary voltage blocking while minimizing intrusion into the current-carrying drift region, thereby preserving maximum current-carrying area while achieving adequate blocking capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The compensation structure utilizes the vertical dimension by extending compensation regions deep into the semiconductor substrate. This vertical extension allows the compensation structures to provide adequate voltage blocking without requiring excessive lateral space, thereby preserving current-carrying area in the horizontal plane.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides a low-ohmic path for charge carrier depletion, enhancing the blocking capability and reducing switching losses while maintaining voltage stability.

Implementation Method 1

The bridge structure electrically connects the at least one strip-shaped edge compensation region with the at least one strip-shaped cell compensation region within the edge termination region

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9704954B2Semiconductor device and a method for forming a semiconductor device
Publication Date: 2017.07.11 INFINEON TECH AUSTRIA AG
  • US9704954B2 patent drawing
  • US9704954B2 patent drawing
  • US9704954B2 patent drawing

AI summary

A semiconductor device comprises at least one strip-shaped cell compensation region of a vertical electrical element arrangement, at least one strip-shaped edge compensation region and a bridge structure. The at least one strip-shaped cell compensation regions extends into a semiconductor substrate and comprises a first conductivity type. Further, the at least one strip-shaped cell compensation region is connected to a first electrode structure of the vertical electrical element arrangement. The at least one strip-shaped edge compensation region extends into the semiconductor substrate within an edge termination region of the semiconductor device and outside the cell region. Further, the at least one strip-shaped edge compensation region comprises the first conductivity type. The bridge structure electrically connects the at least one strip-shaped edge compensation region with the at least one strip-shaped cell compensation region within the edge termination region.