Strip Socket Burn-In Board With Integrated Heating and Monitoring
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Solution Overview
Problem
Conventional semiconductor burn-in systems are costly and time-consuming due to the manual loading of individual devices into discrete sockets, requiring significant resources for high-volume device testing.
Innovation Solution
A burn-in board with a strip socket that integrates heating, allowing for simultaneous loading and testing of multiple semiconductor devices on a device strip, featuring a socket base, a movable socket lid with heating blocks, and conductive contacts for independent monitoring and control of each device, reducing the need for external thermal chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If individual devices are manually loaded into discrete sockets on a burn-in board, then each device can be individually tested, but the process is time-consuming and requires significant resources for high-volume testing
Solution Approach 1:
The device array is segmented into individual device regions within a single socket, allowing each device to be independently tested while maintaining a compact structure that reduces setup time and increases throughput
Solution Approach 2:
Multiple device testing functions are merged into a single integrated socket structure with shared heating and control systems, eliminating the need for multiple discrete sockets and manual loading operations
2Temperature
If external thermal chambers are used for heating devices during burn-in testing, then uniform temperature control can be achieved, but the system becomes more complex and resource-intensive
Solution Approach 1:
The heating function is merged directly into the socket structure through integrated heating blocks, eliminating the need for separate external thermal chambers while maintaining effective temperature control for device burn-in testing
Solution Approach 2:
Heating blocks serve as intermediary elements between the control system and devices, providing localized thermal control directly at the device level without requiring complex external thermal chamber infrastructure
3Measurement precision
If discrete sockets are used for each device, then individual device monitoring is possible, but the resource requirements and cost increase significantly for high-volume testing
Solution Approach 1:
The socket is segmented into multiple device regions with independent conductive contacts for each device, enabling individual monitoring and testing while sharing common infrastructure to reduce costs and increase productivity
Solution Approach 2:
The single socket structure serves multiple functions by accommodating and independently testing multiple devices simultaneously, replacing the need for multiple discrete sockets and reducing overall system resource requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces setup time and resource requirements by enabling high-volume burn-in testing of multiple devices simultaneously, allowing for efficient identification of failed devices and independent temperature control without the need for external heating, thus improving the efficiency and cost-effectiveness of the burn-in process.
Implementation Method 1
heating block to provide heating to the device strip
Data Source
AI summary
A burn-in board for burn-in testing of semiconductor devices includes a strip socket mounted to a PCB. The strip socket includes a socket base configured to receive a device strip including an array of semiconductor devices, and a socket lid including at least one heating block. The socket lid is movable moved between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the socket lid including the heating block(s) is closed down on the mounted device strip. The strip socket includes conductive contacts configured to contact individual semiconductor devices on the device strip to allow selective monitoring of individual semiconductor devices during a burn-in test process. The burn-in board may also include heating control circuitry to control the heating block(s) during the burn-in test process.