Strip Substrate Layout to Prevent Sawing-Induced Short Circuits
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Solution Overview
Problem
Semiconductor packages face reliability issues due to damage in the package substrate, which can inhibit functionality, particularly when the substrate is compromised during the sawing process, leading to potential short-circuits and transmission power reductions.
Innovation Solution
A strip substrate design featuring a dielectric layer with a saw line pattern, conductive dummy patterns, and power/ground patterns, where the conductive dummy patterns are strategically positioned between power/ground patterns and the saw line region, with chamfered corners to prevent damage and short-circuits during the sawing process, and a semiconductor package with a package substrate that includes these features to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the package substrate is damaged during the sawing process, then manufacturing efficiency is maintained, but reliability deteriorates due to potential short-circuits and transmission power reductions
Solution Approach 1:
The patent applies preliminary action by pre-defining saw line patterns and conductive dummy patterns on the substrate before the actual sawing process. These patterns are strategically positioned to prevent damage propagation and short-circuits during cutting, thereby improving reliability without adding operational complexity
Solution Approach 2:
The conductive dummy pattern acts as an intermediary element between the saw line pattern and the power/ground patterns. It serves as a protective buffer that prevents direct damage transmission from the sawing process to the functional conductive structures, resolving the contradiction between maintaining simple substrate structure and ensuring high reliability
2Reliability
If conductive dummy patterns are positioned between power/ground patterns and saw line region, then reliability improves by preventing short-circuits, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes parameter changes by optimizing the distance between the conductive dummy pattern and the power/ground patterns to be within 10-30 micrometers. This specific parameter range ensures effective short-circuit prevention while maintaining compatibility with standard fabrication processes, thus improving reliability without significantly increasing manufacturing complexity
3Strength
If chamfer shapes are added to metal plate patterns at corner intersections, then substrate damage resistance improves, but manufacturing precision requirements increase
Solution Approach 1:
The chamfer shape applied to the metal plate pattern corner serves as a beforehand cushioning measure. By pre-shaping the corner with a chamfer at the intersection with the saw line pattern, the design anticipates and mitigates potential damage from the sawing process, improving strength without requiring excessively high manufacturing precision
Data Source
AI summary
A strip substrate comprises a dielectric layer comprising a unit region and a saw line region, a saw line pattern on the saw line region, a conductive dummy pattern extending from the saw line pattern and toward the unit region, and power/ground patterns on the unit region. The power/ground pattern includes a first lateral surface that extends in a first direction and is proximate to the saw line pattern, a second lateral surface that extends in a second direction and is proximate to the conductive dummy pattern, and a third lateral surface that connects the first lateral surface and the second lateral surface.