Strip Test Retesting Using Nearest Probe Set
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Solution Overview
Problem
Conventional strip test methods require unloading and reloading of assembly strips for retesting failed semiconductor devices, increasing manufacturing time and risking incorrect test results due to potential probe malfunctions.
Innovation Solution
A strip test method where the assembly strip is not unloaded after the first electrical test, allowing failed devices to be retested by the nearest probe set that successfully contacted them during the first test, ensuring accurate and efficient retesting without increasing manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the assembly strip is unloaded and reloaded for retesting failed devices, then the test can be repeated, but the manufacturing time increases and production output decreases
Solution Approach 1:
The patent applies preliminary action by keeping the assembly strip loaded on the base after the first electrical test, so that when a device fails, it can be immediately retested without unloading and reloading. The system preliminarily positions all probe sets and the assembly strip in place, enabling rapid retesting of failed devices by simply moving the probe set to a different location, thus eliminating the time-consuming unloading/reloading process while ensuring reliable test results
Solution Approach 2:
The patent applies dynamics by making the probe set movable relative to the base. Instead of fixing the probe set in one position, the system can dynamically move the probe set to different locations on the base to test different devices. This dynamic capability allows the same probe set to sequentially test multiple devices including failed ones, maintaining high productivity while ensuring accurate retesting by using a known-good probe set
2Productivity
If the same probe set is used for retesting failed devices, then the test can be repeated, but incorrect test results may occur due to probe malfunction
Solution Approach 1:
The patent applies discarding and recovering by identifying and discarding (avoiding use of) probe sets that malfunctioned during the first test, and recovering (reusing) the same probe sets that successfully tested devices. The system records which probe sets passed and failed, then selectively assigns probe sets for retesting based on their performance history, ensuring that failed devices are retested by known-good probe sets while maintaining high productivity
Solution Approach 2:
The patent applies feedback by using the test results from the first electrical test to guide the selection of probe sets for retesting. The system receives feedback about which probe sets malfunctioned and which succeeded, then uses this information to make informed decisions about probe set assignment for subsequent tests, thereby ensuring test accuracy while maintaining efficient production
3Loss of time
If the assembly strip is unloaded after testing, then the testing process is complete, but retesting requires additional loading time
Solution Approach 1:
The patent applies continuity of useful action by keeping the assembly strip continuously loaded on the base throughout the testing process, including retesting. Instead of interrupting the process by unloading and reloading, the system maintains the strip in a ready state, allowing probe sets to be moved and reassigned without stopping the overall testing workflow. This continuous operation eliminates idle time while the system intelligently manages probe set allocation based on test results
Data Source
AI summary
A strip test method includes the following steps. First, an assembly strip is provided, wherein the assembly strip includes a plurality of semiconductor devices, each having a plurality of leads. A test socket and a base are provided, wherein the test socket has a plurality of probe sets. The assembly strip is loaded to the base. The probe sets electrically contacts the leads of the semiconductor devices simultaneously and respectively so as to process an electrical test. When one of the semiconductor devices is failed in the electrical test, one of the base and the test socket are relatively moved in such a manner that the failed one of the semiconductor devices is corresponding to one of the probe sets which is successful in the electrical test and is the nearest to the failed one of semiconductor device. Finally, the successful and nearest one of probe sets simultaneously and electrically contacts the leads of the failed one of the semiconductor devices so as to process another electrical test again.