Electroplated Screw Grindstone with Stripe-Level Plating
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Solution Overview
Problem
Existing electroplated tools and screw-shaped grindstones for grinding gears face issues with chip discharge capacity and processing accuracy due to inadequate gap formation between abrasive grains, leading to clogging and decreased efficiency.
Innovation Solution
The electroplated tool features a plating layer with a difference in height in a stripe manner, where abrasive grains are arranged to intersect the processing direction, allowing efficient chip discharge and maintaining consistent abrasive grain intervals for accurate processing, while the screw-shaped grindstone has abrasive grains fixed in a stripe manner perpendicular to the processing direction to facilitate chip discharge without being caught by the abrasive grain belt.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the abrasive grain electroplating amount is increased, then the grinding efficiency is improved, but clogging and welding occur reducing processing quality
Solution Approach 1:
The grindstone surface is divided into multiple abrasive grain bands in the radial direction, with each band containing abrasive grains arranged at specific intervals. This segmentation creates chip pockets between the bands and within bands, allowing chips to be discharged efficiently while maintaining sufficient abrasive grains for grinding, thus resolving the contradiction between grinding efficiency and preventing clogging.
Solution Approach 2:
Different regions of the grindstone surface have different abrasive grain densities and arrangements. The abrasive grain bands are positioned at specific radial locations with controlled spacing, creating local variations in grinding capacity and chip discharge capability. This local quality differentiation allows the grindstone to simultaneously achieve efficient grinding in contact zones and effective chip discharge in non-contact zones.
2Object-generated harmful factors
If the gap between abrasive grains is enlarged to prevent clogging, then chip discharge is improved, but unprocessed portions occur reducing processing accuracy
Solution Approach 1:
The invention transitions from considering only tangential spacing between abrasive grains to incorporating radial positioning of abrasive grain bands. By arranging abrasive grains in multiple radial bands with specific interval control, the system creates three-dimensional chip discharge pathways that do not compromise the tangential grinding coverage, thus preventing clogging while maintaining processing accuracy.
Solution Approach 2:
The abrasive grain bands are positioned and spaced to dynamically interact with the workpiece during rotation. The interval between bands and within bands is controlled to allow chips to be ejected during the non-grinding portion of the rotation cycle, while maintaining sufficient grain density in the grinding contact zone to ensure accurate processing without unprocessed portions.
3Object-generated harmful factors
If multiple abrasive grain bands are provided in radial direction, then chip pockets are formed, but chips get caught in outer abrasive grain bands hindering discharge
Solution Approach 1:
The abrasive grain bands are arranged asymmetrically in the radial direction with specific spacing relationships. Outer bands are positioned and spaced differently from inner bands, creating asymmetric chip discharge pathways that prevent chips from being trapped. The asymmetric arrangement ensures that chips generated in inner bands can be efficiently discharged outward without being caught by outer bands.
4Object-generated harmful factors
If masking is applied to form level difference, then chip pockets are created, but gaps between abrasive grains are not guaranteed leading to continuous clogging
Solution Approach 1:
The masking pattern is pre-designed and applied before electroplating to define the exact positions of chip pockets and abrasive grain bands. The masking creates a template that ensures consistent gap formation between abrasive grains during the electroplating process, preventing continuous clogging while maintaining reliable chip pocket structure. This preliminary action guarantees both chip pocket formation and gap consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances chip discharge capacity and processing accuracy, preventing clogging and enabling highly efficient grinding operations.
Implementation Method 1
a plating layer formed provided with a difference in height in a stripe manner on a parent material... and abrasive grains provided by electroplating
Implementation Method 2
abrasive grains provided by electroplating, and exposed on a surface of the plating layer
Data Source
AI summary
Provided are: an electroplated tool; a screw-shaped grindstone for grinding a gear; a method for manufacturing the electroplated tool; and a method for manufacturing the crew-shaped grindstone for grinding a gear. Said tool having a parent material, a plating layer that has a high-level portion and a low-level portion formed as strips on the parent material at different heights along the direction intersecting the processing direction, and electrodeposited abrasive grains exposed from the surface of the plating layer. The difference in height of the plating layer is preferably 50-100% of the average particle diameter of the abrasive grains, the width of the high-level portion of the plating layer is preferably 150-200% of the average particle diameter of the abrasive grains, and the width of the low-level portion of the plating layer is preferably 100-800% of the average particle diameter of the abrasive grains.