Stripline Interconnect Substrate for Fine-Line Adhesion Strength
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Solution Overview
Problem
The adhesion strength between interconnect patterns and insulating layers in stripline interconnect substrates is compromised due to reduced line width and space, leading to a risk of disconnection.
Innovation Solution
An interconnect substrate design with a stripline configuration that includes a first interconnect layer covered by insulating layers on both sides, forming a stripline structure with improved adhesion through additional insulating layers and ground planes, allowing for narrower line widths and spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the line width and space of the interconnect pattern are reduced to increase interconnect density, then interconnect density is improved, but adhesion strength between the interconnect pattern and insulating layers deteriorates
Solution Approach 1:
The patent transitions from a single-sided insulating layer configuration to a dual-sided insulating layer configuration, where insulating layers are formed on both the upper and lower surfaces of the interconnect pattern. This dimensional change in the insulating structure provides additional adhesion surfaces without increasing the line width or space, thereby maintaining high interconnect density while improving overall adhesion strength
Solution Approach 2:
The patent employs a composite structure consisting of the interconnect pattern sandwiched between two insulating layers, creating a layered composite material system. This composite configuration allows the thin interconnect pattern to gain enhanced mechanical support and adhesion from the combined insulating layers on both sides, resolving the contradiction between reduced dimensions and maintained strength
Data Source
AI summary
An interconnect substrate includes a first interconnect layer, a first insulating layer covering a side surface and a lower surface of the first interconnect layer, a second insulating layer disposed on the first insulating layer and covering an upper surface of the first interconnect layer, a second interconnect layer formed on a lower surface of the first insulating layer, and a third interconnect layer formed on an upper surface of the second insulating layer, wherein the second interconnect layer includes a first ground plane, wherein the third interconnect layer includes a second ground plane, and wherein the first ground plane, the first insulating layer, the first interconnect layer, the second insulating layer, and the second ground plane constitute a stripline.