Stripped EMIB Layout for Lower-Layer Package Interconnect

The patent extracts the interconnect bridge function from the traditional multi-layer substrate architecture by implementing a stripped EMIB (embedded multi-die interconnect bridge) structure. This removes the need for extensive substrate layers dedicated to interconnecting, as the bridge is now a separate, optimized component that can be precisely positioned and connected to dies, thereby reducing overall package real estate while maintaining signal integrity.

The patent transitions from a planar, two-dimensional substrate layout to a three-dimensional stacked architecture using the stripped EMIB. By vertical stacking of dies interconnected through the EMIB bridge, the design achieves higher interconnect capacity and better signal referencing without proportionally increasing the package footprint, effectively utilizing the Z-dimension to reduce real estate consumption.

The patent applies local quality by concentrating signal referencing resources at critical locations rather than distributing them uniformly across multiple substrate layers. The stripped EMIB provides localized, high-quality signal referencing exactly where needed at the die-EMIB interface, eliminating the need for extensive substrate routing layers while maintaining or improving signal integrity through precision-aligned interconnections.

The stripped EMIB acts as an intermediary component between the substrate and the dies, providing superior signal referencing functionality that eliminates the need for complex multi-layer substrate routing. This mediator structure offers controlled impedance pathways and dedicated reference planes directly at the interconnect interface, achieving better signal quality with fewer overall layers.