Stripping Liquid for Semiconductor Wafer Support Plate Removal
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Solution Overview
Problem
The challenge lies in efficiently removing a support plate from a stack comprising a semiconductor wafer and an adhesive, as thinner wafers are more prone to damage during handling, and existing methods struggle with the adhesive's strong bonding, which complicates the process of upgrading and downsizing electronic components.
Innovation Solution
A stripping liquid is developed, comprising a mixture of low-polar and high-polar solvents that effectively solvate the adhesive's functional groups, allowing for quick dissolution and easy removal of the support plate, utilizing a combination of solvents like ethylbenzene and propylene glycol methyl ether acetate, which are safe and cost-effective, and adjusting their ratios to match the adhesive's solubility parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of a semiconductor wafer is reduced to provide thinner chips, then the chip thickness is reduced, but the wafer strength decreases making it prone to damage during handling
Solution Approach 1:
The wafer handling process is segmented into two distinct phases: during conveyance, the wafer is supported by a support plate to maintain strength; during processing, the wafer is separated from the support plate to enable manufacturing operations. This segmentation allows thin wafers to be handled safely without damage while still enabling processing.
Solution Approach 2:
A support plate is introduced as an intermediary element between the thin wafer and the handling system. The support plate provides mechanical strength during conveyance and processing, while the adhesive acts as a temporary bonding mediator that allows secure attachment during handling and controlled removal during processing.
2Strength
If a support plate is attached to the wafer using adhesive for conveyance, then the wafer can be handled safely, but the removal of the support plate becomes difficult due to strong bonding
Solution Approach 1:
The adhesive properties are optimized to change based on environmental parameters. The adhesive exhibits temperature-dependent viscosity changes, allowing it to provide strong bonding at room temperature during handling, while becoming more fluid at elevated temperatures during removal, facilitating easy separation of the support plate from the wafer.
3Ease of operation
If a conventional stripping liquid is used to remove the support plate, then the process can be completed, but the adhesive dissolution is slow and time-consuming
Solution Approach 1:
The stripping liquid is formulated with specific solvent composition and temperature parameters optimized for rapid adhesive dissolution. By controlling the temperature and solvent concentration, the adhesive dissolves quickly and completely, reducing the stripping time while ensuring complete support plate removal without residue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and rapid removal of the support plate, enhancing the fabrication efficiency of electronic components by ensuring the adhesive's quick dissolution and minimizing the time required for the process, thus addressing the issue of wafer damage and handling complexity.
Implementation Method 1
The stripping liquid includes a first solvent and a second solvent. The second solvent have a polarity higher than the first solvent.
Data Source
AI summary
According to one embodiment, a stripping liquid is provided. The stripping liquid is for removing a support plate from a stack. The stack includes a substrate, the support plate, and an adhesive. The Adhesive is placed between the substrate and the support plate. The adhesive includes a compound. The compound has a first functional group and a second functional group differing from each other. The stripping liquid includes a first solvent and a second solvent. The second solvent have a polarity higher than the first solvent.