Structural Busbar With Integrated Cooling for Dense Computing Tiles
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Solution Overview
Problem
High performance computing systems require high-speed connectivity, desirable power performance, and dense integration, but existing technologies often struggle to provide efficient structural support, power delivery, and cooling solutions for computing tiles in computing systems.
Innovation Solution
A structural busbar system is introduced that includes a power layer, ground layer, insulating layers, and integrated coolant manifolds to support and power computing tiles, while also providing efficient cooling and thermal management through integrated inlet and outlet manifolds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate components are used for structural support, power delivery, and cooling, then each function can be optimized independently, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent combines structural support, power delivery, and cooling functions into a single integrated busbar component. The busbar includes a structural body with embedded power conductors and coolant channels, eliminating the need for separate support structures, power cables, and cooling plates. This merging reduces assembly complexity while maintaining functional optimization through unified design.
Solution Approach 2:
The busbar is designed as a multi-functional component that simultaneously provides mechanical support, electrical power delivery, and thermal management. The structural body serves as both a support element and a housing for power and cooling systems, allowing a single component to perform multiple functions that would traditionally require separate parts.
2Productivity
If dense integration of computing tiles is implemented, then productivity and space utilization improve, but heat dissipation challenges increase
Solution Approach 1:
The cooling channels are integrated directly into the busbar structure, positioning the thermal management system in close proximity to the computing tiles. This integration enables efficient heat removal while maintaining dense packing of computing components, as the cooling system occupies the same spatial envelope as the structural support rather than requiring additional space.
3Reliability
If multiple separate components are used for power and ground connections, then electrical connectivity can be established, but manufacturing complexity and assembly time increase
Solution Approach 1:
The power and ground connections are integrated into the busbar structure through embedded conductors and direct contact interfaces. The computing tiles connect to both power and ground simultaneously through single connection points on the busbar, eliminating the need for separate wiring operations and reducing assembly time while maintaining reliable electrical connectivity.
4Temperature
If integrated coolant manifolds are positioned between busbar layers, then cooling efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The coolant manifolds are formed as integral parts of the busbar structure, with inlet and outlet ports positioned between the busbar layers. This integration ensures precise positioning of the cooling channels relative to the computing tiles, as the manifolds and structural body are manufactured as a single piece rather than assembled from separate components.
Solution Approach 2:
The busbar employs composite construction with different materials optimized for structural support, electrical conduction, and thermal management. This allows the integration of coolant manifolds between layers while maintaining the structural integrity and electrical performance of the busbar, as each layer can be optimized for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The busbar system achieves high-speed connectivity, mechanical integrity, and effective heat dissipation, enabling dense integration and reliable power delivery to computing tiles, thereby enhancing the performance of high-performance computing systems.
Implementation Method 1
an integrated inlet manifold configured to deliver coolant to each of the plurality of computing tiles and an integrated outlet manifold configured to receive the coolant from each of the plurality of computing tiles
Data Source
AI summary
Aspects of this disclosure relate to a structural busbar for power delivery in a computing system. The computing system can include a plurality of computing tiles and a busbar with the plurality of computing tiles positioned thereon. The busbar can provide structural support for the plurality of computing tiles and electrical power to the plurality of computing tiles. In some embodiments, the structural busbar can also provide coolant to each of the computing tiles. In certain embodiments, a structural busbar can provide power and electrical support to any suitable electronic modules.