Structural Thermal Interface Pad for Low-Resistance Heat Transfer
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Solution Overview
Problem
Existing thermal interface pads for electronic devices often fall short in achieving high thermal conductivity, low contact resistance, compressible/recoverable capability under pressure, and long-term stability simultaneously.
Innovation Solution
A structural thermal interface pad comprising a structural sheet with arrays of small holes and convex/concave bowls, filled with a material such as liquid metal, which allows for efficient heat transfer and deformation matching with heat generating and dissipating elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal interface pad uses thermally conductive particles in a matrix material or thermally conductive porous pad with resin, then it provides basic thermal conduction, but it cannot simultaneously achieve high thermal conductivity, low contact resistance, compressible/recoverable capability, and long-term stability
Solution Approach 1:
The patent employs a porous foam core structure that enables both compression and recovery capabilities. The porous architecture allows the material to be compressed under pressure and return to its original shape, providing the necessary adaptability while maintaining structural integrity for long-term stability.
Solution Approach 2:
The patent creates a composite thermal interface pad by combining thermally conductive particles or powder with a foam material. This composite structure integrates the thermal conductivity benefits of particles with the compressible/recoverable properties of the foam matrix, achieving multiple performance requirements simultaneously.
2Stability of the object's composition
If the thermal interface pad is made rigid to maintain structural stability, then long-term stability is improved, but compressible/recoverable capability deteriorates
Solution Approach 1:
The foam-based porous structure provides inherent compressibility and recoverability while maintaining overall structural stability. The cellular architecture allows localized deformation during compression while preserving the global structural integrity needed for long-term stability.
Solution Approach 2:
By combining rigid thermally conductive particles with a flexible foam matrix, the composite material achieves a balance between structural stability and compressible/recoverable capability. The particles provide thermal conductivity and structural framework, while the foam provides flexibility and recovery.
3Reliability
If thermally conductive particles are densely packed to increase thermal conductivity, then heat transfer efficiency is improved, but contact resistance increases due to poor interface contact
Solution Approach 1:
The porous foam structure facilitates better contact between the thermal interface pad and the heat generating/dissipating surfaces. This improved contact reduces contact resistance while the thermally conductive particles embedded in the foam maintain high thermal conductivity through the material bulk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structural thermal interface pad achieves high thermal conductivity, low contact resistance, and long-term stability while being compressible and recoverable, effectively addressing the limitations of prior art.
Implementation Method 1
a thermal interface pad disposed between two opposing elements such as a heat generating element like a flip chip and a heat dissipating element like a lid or heatsink of an electronic device including a flip chip package so as to transfer heat from one to the other
Implementation Method 2
the structural sheet with a top surface and a bottom surface includes a first structure and a second structure, the first structure is an array of small holes completely passing through the sheet from its top surface to its bottom surface, and the second structure is an array of convex and/or concave bowls on the top surface and/or on the bottom surface of the structural sheet
Data Source
AI summary
The disclosure describes a structural thermal interface pad between two opposing elements such as a flip chip and a heatsink of an electronic device to provide a thermal pathway for heat transfer from one to the other, comprising: a structural sheet and a filling material, wherein the structural sheet includes a first structure and a second structure, the first structure is an array of small holes, the second structure is an array of convex and/or concave bowls, and the filling material fills in a space of the structural sheet, covering at least a portion of the structural sheet. The disclosure also describes a structural thermal interface pad, comprising: a structural pillow and a filling material, wherein the structural pillow includes three layers of sheets, where the two outer sheets form an envelope, enclosing the middle sheet inside, and the middle sheet includes a first structure and a second structure.