Multi-layer element with laterally structured adhesive for RFID antennas
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Solution Overview
Problem
Current methods for producing multi-layer elements, such as RFID antennas and flexible printed circuit boards, face challenges in achieving high-quality production with high process reliability at low costs, often resulting in excess material waste and adhesive-related issues.
Innovation Solution
A method involving a laterally structured adhesive layer is applied to a substrate, allowing partial adhesive contact in desired areas and minimal or no contact in non-conductive areas, enabling precise cutting and easy removal of excess conductor foil, thereby reducing adhesive usage and material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied in a continuous layer over the entire substrate surface, then strong bonding is achieved, but adhesive costs and material waste increase
Solution Approach 1:
The continuous adhesive layer is segmented into discrete adhesive zones positioned at specific locations where conductor foil bonding is required. This segmentation reduces adhesive application to only necessary areas, decreasing adhesive waste while maintaining bonding strength at critical interfaces.
Solution Approach 2:
Different adhesive properties and applications are applied to different regions of the substrate. Adhesive is applied with specific characteristics (coverage, thickness, composition) tailored to local bonding requirements, rather than using a uniform approach across the entire substrate surface.
2Reliability
If adhesive is applied to entire substrate surface, then complete coverage is achieved, but manufacturing costs increase
Solution Approach 1:
The adhesive application process is segmented to target only specific zones where bonding is required for conductor foil attachment. This reduces overall adhesive consumption and associated costs while maintaining bonding reliability at critical locations through focused adhesive application.
Solution Approach 2:
Instead of applying adhesive across the entire substrate surface (excessive action), adhesive is applied partially only to specific zones where bonding is necessary. This partial action approach reduces material costs while sufficient bonding reliability is achieved at the targeted adhesive zones.
3Manufacturing precision
If conductor foil is cut along adhesive area boundaries, then precise conductor structure is achieved, but excess film pieces require removal
Solution Approach 1:
The excess conductor foil pieces that are not required for the final conductor structure are extracted and removed from the substrate. This is facilitated by the discrete adhesive zones, which allow clean separation of unnecessary foil pieces while retaining precisely positioned conductor elements that are bonded to the substrate.
Solution Approach 2:
The conductor foil is effectively segmented into required conductor structures and excess portions through cutting along adhesive zone boundaries. The discrete adhesive zones facilitate this segmentation by providing clear separation lines, allowing efficient removal of excess material without compromising the precision of the retained conductor structures.
4Strength
If adhesive is applied in laterally extended areas, then strong bonding is achieved, but flexibility and weight of multi-layer element decrease
Solution Approach 1:
The adhesive bonding is segmented into discrete zones rather than continuous extended areas. This segmentation reduces the total volume and weight of adhesive required while maintaining bonding strength at specific critical locations where conductor foil attachment is necessary.
Solution Approach 2:
Adhesive application is optimized for local bonding requirements rather than uniform coverage. Strong bonding is achieved locally at adhesive zones where needed, while eliminating adhesive (and associated weight) from laterally extended areas where bonding is not required, thereby improving flexibility and reducing overall weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces adhesive costs, minimizes material waste, and enhances the flexibility and weight reduction of multi-layer elements, while allowing the use of more brittle adhesives and improving the structural integrity of the finished products.
Implementation Method 1
a laterally structured adhesive layer is applied to a substrate, in which a partial adhesive contact is created between the substrate and the conductive film in desired first areas
Data Source
Figure 1A~1C
Figure 2A~2B
Figure 3A~4E
AI summary
The invention relates to a method for producing a multi-layer element having a substrate and having at least one conductor structure connected to the substrate in a planar manner, which conductor structure has first regions made of electrically conductive material, which electrically conductive material is present in accordance with a specified pattern, electrically non-conductive second regions lying between the first regions. The method according to the invention is characterized by the following steps: connecting a conductor film (142) to the substrate (200) by means of a laterally structured adhesive layer (220) lying therebetween, in such a way that, in the first regions (240), a partial adhesive contact between the substrate and the conductor film is produced in a plurality of adhesion zones (224) and, in laterally extended second regions (250), the conductor film is not connected to the substrate by the adhesive or is connected to the substrate less strongly by the adhesive; structuring the conductor film by cutting the conductor film along boundaries of the first regions; and removing contiguous film pieces (142') of the conductor film from laterally extended second regions (250). The method is provided in particular for producing RFID antennas or flexible circuit boards in a roll-to-roll method.