Structured Carrier Strip for Optoelectronic Components
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Solution Overview
Problem
Existing optoelectronic components are not produced cost-effectively and lack mechanical stability, particularly in high-temperature applications.
Innovation Solution
A structured connection carrier with interstices filled by an electrically insulating material, such as silicone or silicone-epoxy hybrid, is used, which enhances mechanical stability and adhesion, allowing for cost-effective production and operation up to 130°C continuously and 260°C briefly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the carrier strip is structured to improve adhesion with electrically insulating material, then mechanical stability and adhesion are improved, but manufacturing complexity increases
Solution Approach 1:
The carrier strip is structured with recesses or porous features that increase surface area and provide mechanical interlocking with the electrically insulating material. This porosity/structuring enables improved adhesion while the structure itself serves as the anchoring mechanism, eliminating the need for separate anchoring elements.
Solution Approach 2:
The connection carrier combines the structured conductive carrier strip with electrically insulating material to create a composite structure. The carrier strip provides mechanical strength and electrical conductivity, while the insulating material provides electrical isolation and additional mechanical stability, with the structured interface enhancing their bond.
2Strength
If gaps in the carrier strip are filled with electrically insulating material, then mechanical stiffening is achieved, but manufacturing steps increase
Solution Approach 1:
The electrically insulating material serves multiple functions simultaneously: it fills the gaps in the carrier strip to provide mechanical stiffening, provides electrical insulation between conductive elements, and adheres to the structured carrier strip to enhance overall structural integrity. This multi-functionality reduces the need for separate components.
Solution Approach 2:
The electrically insulating material is applied to fill the recesses or gaps in the structured carrier strip. This filling action provides mechanical stiffening by creating a more rigid composite structure, while the porous or structured interface ensures proper adhesion between the materials.
3Reliability
If the connection carrier is designed for high-temperature stability, then thermal resistance is improved, but material selection and manufacturing complexity increase
Solution Approach 1:
The connection carrier is designed to maintain its mechanical and electrical properties at elevated temperatures. The carrier strip material and electrically insulating material are selected and configured to resist thermal degradation, allowing the component to operate reliably at high temperatures without delamination or structural failure.
Solution Approach 2:
The combination of conductive carrier strip material and electrically insulating material creates a composite structure with enhanced thermal stability. The structured interface and proper material selection ensure that the bond between layers remains stable at high temperatures, providing reliable thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and mechanically stable optoelectronic component with improved adhesion and thermal resistance, reducing the risk of delamination and enabling efficient production processes.
Implementation Method 1
the adhesion between the electrically insulating material and the carrier strip is improved as a result of the structuring of the carrier strip
Implementation Method 2
filling in gaps in the carrier strip can lead to mechanical stiffening or strengthening of the carrier strip
Implementation Method 3
the connection is stable for temperatures up to 260°C... the electrically insulating material does not delaminate from the structured carrier strip
Data Source
Figure 1A~1D
Figure 1E~1F
AI summary
An optoelectronic component having a connecting carrier (10) is provided, comprising a structured carrier strip (1), in which clearances (2) are filled in with an electrically insulating material (3), and an optoelectronic semiconductor strip (4), said component being fastened to a top (10a) of the connecting carrier and being electrically connected.