Structured Dielectric Printing for Passive Electronic Components
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Solution Overview
Problem
Existing methods for producing optoelectronic components, such as organic light emitting diodes, require expensive and complex photolithographic processes to apply insulators and dielectrics, which are costly and inefficient.
Innovation Solution
A method for producing passive electronic components and optoelectronic assemblies that eliminates the need for photolithography by applying dielectrics and electrode layers in a structured fashion using techniques like printing or self-assembling monolayers, directly forming the desired structure without the need for planar application and subsequent etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithographic process is used to apply insulators and dielectrics, then manufacturing precision is improved, but device complexity and production cost increase
Solution Approach 1:
The patent extracts and removes the photolithographic process from the manufacturing sequence entirely. Instead of applying planar layers and then structuring them through photolithography, the method directly applies structured dielectric and electrode layers using printing techniques, thereby eliminating the complex photolithographic step while maintaining the required precision for insulator and dielectric application.
Solution Approach 2:
The patent performs preliminary structuring by directly applying materials in the desired structured form from the beginning, rather than applying planar layers and then structuring them later. The dielectric and electrode layers are printed with the final desired structure already formed, which eliminates subsequent photolithographic structuring steps and reduces overall process complexity.
2Manufacturing precision
If photolithographic process is used to apply insulators and dielectrics, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
The patent extracts and eliminates the expensive photolithographic process from the manufacturing sequence. By using direct printing methods to apply structured dielectric and electrode layers, the method removes the need for costly photoresists, mask alignment systems, and multiple development/etching steps, thereby significantly reducing production cost while maintaining manufacturing precision.
Solution Approach 2:
The patent replaces expensive, complex photolithographic materials and processes with simpler, cheaper printing-based approaches. The direct printing method uses less material and eliminates the need for expensive photoresists and multiple processing chemicals, making the manufacturing process more cost-effective while achieving the required precision for insulator and dielectric application.
3Ease of manufacture
If planar application followed by etching is used, then ease of manufacture is improved, but productivity decreases due to multiple process steps
Solution Approach 1:
The patent performs preliminary structuring by directly applying materials in the desired structured form from the beginning. The dielectric and electrode layers are printed with the final desired structure already formed, which eliminates subsequent photolithographic structuring steps and reduces overall process complexity, thereby improving productivity without sacrificing ease of manufacture.
Solution Approach 2:
The patent merges the layer application and structuring steps into a single direct printing operation. Instead of separately applying planar layers and then structuring them through multiple photolithographic steps, the method combines these functions by directly printing the structured layers in one step, thereby reducing the total number of process steps and improving production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and cost-effectively produces passive electronic components and optoelectronic assemblies by eliminating the need for expensive photoresists and complex etching processes, enabling more efficient integration of capacitors and resistors within the component structure.
Implementation Method 1
by deposition with the aid of SAMs (self assembling monolayers)
Data Source
AI summary
Various embodiments may relate to a method for producing a passive electronic component, including forming a first electrically conductive layer on a substrate, forming a second electrically conductive layer on the first electrically conductive layer, forming a first trench in the first and second electrically conductive layers such that the substrate is exposed in the first trench, wherein the first trench separates a first contact region from a second contact region, applying a dielectric in a structured fashion to the second electrically conductive layer in the first contact region and at least partly to the substrate in the first trench such that the dielectric electrically insulates the first contact region from the second contact region, and applying an electrically conductive electrode layer in a structured fashion to the dielectric above the first contact region and to the second contact region.