Structured Fabric for Wearable Electronics

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Solution Overview

Problem

Fabric-based electronic devices lack the necessary structure and rigidity to maintain shape and functionality, particularly in applications where softness and flexibility are combined with the need for holding electronic components or forming protective cases.

Innovation Solution

Structured fabric is created by laminating warp-knit fabric with a stiffener, such as a polymer film, using an adhesive and alignment posts to maintain the geometry of openings for signal passage, providing both rigidity and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If fabric is used to form electronic device components, then softness and flexibility are improved, but structure and rigidity deteriorate

Engineering Contradiction:
Improvesoftness and flexibilityVSAvoidstructure and rigidity
Core Design Contradiction:
Ease of operationVSStrength

Solution Approach 1:

The patent applies composite materials by combining fabric with stiffening structures (such as rigid frames, reinforcement layers, or structured supports) to create a hybrid material system that exhibits both the softness/flexibility of fabric and the structural rigidity of the reinforcing elements. This allows the electronic device to maintain form factor and structural integrity while preserving the wearable comfort and flexibility of the fabric material.

Inventive Principle:
Principle #40Composite materials

2Shape

If stiffener and adhesive are added to fabric, then shape retention is improved, but device complexity increases

Engineering Contradiction:
Improveshape retentionVSAvoidstructure complexity
Core Design Contradiction:
ShapeVSDevice complexity

Solution Approach 1:

The patent merges the stiffener and adhesive into an integrated assembly where the stiffening structure incorporates built-in adhesive layers or attachment mechanisms. This consolidation reduces the number of separate components and assembly steps, simplifying the overall device structure while maintaining effective shape retention capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs thin film stiffeners or flexible reinforcement layers that provide sufficient structural support without adding significant bulk or complexity. These thin film structures maintain the fabric's flexibility while providing the necessary rigidity for shape retention.

Inventive Principle:
Principle #30Flexible shells and thin films

3Productivity

If openings are cut in stiffener and adhesive, then signal passage is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvesignal passageVSAvoidalignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming alignment features (such as registration marks, guide holes, or positioned templates) on the stiffener or adhesive layer before the cutting process. This pre-positioning system guides the cutting tool to accurately create openings that align with the fabric's signal pathways, reducing the precision demands on the cutting operation itself.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses copying by creating the opening pattern on the stiffener/adhesive as a replica of the fabric's opening pattern. A template or transfer method is used to replicate the exact positions and shapes of the fabric openings onto the stiffener layer, ensuring automatic alignment without requiring high-precision measurement and positioning during manufacturing.

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structured fabric maintains its shape and functionality, allowing for the integration of electronic devices while ensuring signal pathways remain unobstructed, addressing the limitations of traditional fabric-based solutions.

Implementation Method 1

Heat and pressure may be applied while compressing the fabric, adhesive, and stiffener between the upper and lower mold structures to thereby laminate the fabric to the stiffener using the adhesive.

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

Heat and pressure may be applied while compressing the fabric, adhesive, and stiffener between the upper and lower mold structures

Methodology Applied
Scientific EffectHeat: Heating

Implementation Method 3

Heat and pressure may be applied while compressing the fabric, adhesive, and stiffener between the upper and lower mold structures

Methodology Applied
Scientific EffectPressure: Pressure Increase

Data Source

PatentUS11963324B2Structured fabrics for electronic devices
Publication Date: 2024.04.16 APPLE INC
  • US11963324B2 patent drawing
  • US11963324B2 patent drawing
  • US11963324B2 patent drawing

AI summary

Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.