Structured Glass Articles for IC Packages
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Solution Overview
Problem
Existing methods for manufacturing structured glass articles, such as those for integrated circuit packages and microfluidic devices, often result in cavities or channels with imprecise dimensions and irregular surfaces, limiting their optical quality and functionality.
Innovation Solution
A structured glass article is created by fusing a glass cladding layer with a higher etch rate to a glass core layer, allowing for precise cavity formation through selective etching, with the glass core layer acting as an etch stop to ensure optical quality and precise dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photostructuring, molding, or wet etching processes are used to manufacture structured glass articles, then the manufacturing process can be completed, but the cavities or channels have imprecise dimensions and irregular surfaces
Solution Approach 1:
The glass substrate is divided into two distinct layers: a glass core layer that forms the cavity structure and a glass cladding layer that provides structural support and enables selective etching. This segmentation allows each layer to be optimized for its specific function, with the cladding layer having higher etchability to enable precise cavity formation while the core layer maintains structural integrity and optical quality
Solution Approach 2:
The glass cladding layer is designed with locally different properties (higher etch rate) compared to the glass core layer. This local quality difference enables selective removal of the cladding layer through etching, allowing precise control over cavity dimensions and formation of smooth, optically quality surfaces without compromising the overall structural integrity of the glass article
2Manufacturing precision
If the glass cladding layer is etched to form cavities, then precise cavity dimensions can be achieved, but the glass core layer must have lower etch rate to act as etch stop
Solution Approach 1:
The invention changes the chemical composition parameters of the glass layers to achieve different etch rates. The glass cladding layer contains specific compositional characteristics that make it more susceptible to etching, while the glass core layer has compositional properties that resist etching. This parameter change enables precise control of cavity depth as the etchant naturally stops when it encounters the more resistant core layer
Solution Approach 2:
The structured glass article uses a composite structure of two different glass materials with distinct etching properties. The glass cladding layer and glass core layer are bonded together to form a composite material system where each component serves a specific function: the cladding layer enables precise etching for cavity formation, while the core layer acts as an etch stop to define cavity depth and maintain structural integrity
3Reliability
If conventional single-layer glass substrates are used, then the manufacturing process is simpler, but die shift and warpage occur in integrated circuit packages
Solution Approach 1:
The glass substrate is segmented into functional layers with the glass core layer providing a stable base for cavity formation and the glass cladding layer providing structural support and enabling precise etching. This layered segmentation creates a more stable substrate structure that reduces die shift and warpage while maintaining manufacturing feasibility
Solution Approach 2:
The invention changes the physical and chemical parameters of the glass substrate by using different glass compositions in each layer. The glass core layer and glass cladding layer have different thermal expansion coefficients, mechanical properties, and etch rates, which are carefully selected to improve die positioning stability and reduce warpage while maintaining overall substrate integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of glass articles with cavities that are precisely dimensioned and of optical quality, reducing die shift and warpage in integrated circuit packages and enhancing the performance of optical and microfluidic devices.
Implementation Method 1
The glass cladding layer has a higher etch rate in an etchant than the glass core layer
Implementation Method 2
a glass substrate comprising a glass cladding layer fused to a glass core layer
Data Source
AI summary
The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.