Structured Interconnection Film for Bend-Resistant Electronic Bonding
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Solution Overview
Problem
Existing flexible electronic structures fail to adequately resist tensile, shear, and bending stresses, leading to premature failure of interconnection interfaces.
Innovation Solution
An electronic structure comprising a substrate, an electronic component, and an interconnection film with structured conductive and insulating polymer patterns that form a dry adhesive, providing enhanced mechanical resilience and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interconnection techniques (wire bonding, soldering, flip-chip) are used to connect electronic components to substrates, then electrical connection is achieved, but the bonding interfaces are highly susceptible to mechanical bending stresses and eventually break
Solution Approach 1:
The interconnection structure is segmented into multiple layers: a first interconnection layer at the component-substrate interface, a second interconnection layer at the neutral plane, and a compensation layer between them. This segmentation distributes mechanical stresses across different locations, preventing stress concentration at the bonding interface and improving overall interconnection reliability under bending conditions.
Solution Approach 2:
A compensation layer is introduced as an intermediary element between the first and second interconnection layers. This compensation layer absorbs and redistributes mechanical bending stresses, protecting the critical bonding interfaces from direct stress exposure and preventing premature failure.
2Stress or pressure
If the neutral plane is positioned at the interconnection interface (as in prior art), then bending stresses are reduced, but the structure remains vulnerable to tensile and shear stresses
Solution Approach 1:
Different regions of the interconnection structure are assigned different functions: the first interconnection layer provides electrical connection at the component-substrate interface, the compensation layer provides mechanical stress management, and the second interconnection layer provides additional electrical connection at the neutral plane. This local differentiation allows the structure to simultaneously resist bending, tensile, and shear stresses through specialized zones.
Solution Approach 2:
The interconnection structure employs a composite arrangement of multiple functional layers with different mechanical and electrical properties. The combination of interconnection layers and compensation layer creates a composite system that exhibits enhanced resistance to multiple types of mechanical stresses compared to single-layer conventional structures.
3Reliability
If electronic components are made thick and rigid for functional requirements, then component performance is improved, but bending stresses place excessive load on bonding interfaces causing them to break
Solution Approach 1:
The interconnection system is segmented into multiple layers distributed through the thickness of the structure. This segmentation allows the bonding interfaces to be separated by distance and protected by the compensation layer, reducing the mechanical load on each individual interface while maintaining support for thick, rigid electronic components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure exhibits improved resistance to mechanical stresses, allowing bending with a radius of curvature less than 1000 mm and elongation under load without breaking, ensuring durability and flexibility.
Implementation Method 1
an electrically insulating polymer material coating the electrically conductive zone, at least one of the first and second faces of the interconnection film being structured so as to form a dry adhesive film
Data Source
AI summary
An electronic structure includes a substrate; an electronic component; and an interconnection film disposed between the substrate and the electronic component, electrically and mechanically connecting the electronic component to the substrate; the interconnection film including a first face, a second face opposite to the first face, an electrically conductive zone extending from the first face to the second face and an electrically insulating polymer material coating the electrically conductive zone, at least one of the first and second faces of the interconnection film being structured so as to form a dry adhesive film, said at least one of the first and second faces having a plurality of patterns, at least part of the patterns being formed by the electrically insulating polymer material.