Structured Light Measurement for Semiconductor Adhesive Flatness
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Solution Overview
Problem
Current methods for measuring and controlling physical characteristics of semiconductor device elements, particularly in thermo-compression bonding, are inadequate for ensuring conformity with design specifications and flatness requirements.
Innovation Solution
The use of structured light systems and methods to measure physical characteristics of adhesive materials, fillets, and semiconductor device flatness, involving the application of structured light patterns, image creation, and analysis using cameras, integrated into thermo-compression bonding machines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional measurement methods are used for adhesive material and semiconductor device flatness, then the measurement process is simple, but the measurement precision and reliability are insufficient to ensure conformity with design specifications
Solution Approach 1:
The patent replaces traditional mechanical contact measurement methods with optical measurement using structured light projection and camera imaging. This substitution eliminates mechanical contact issues and provides non-contact, high-precision measurement of adhesive material characteristics and device flatness without physical interference
Solution Approach 2:
The patent introduces structured light patterns as an intermediary medium between the measurement system and the object being measured. The structured light serves as a carrier that encodes spatial information about the adhesive material and device surface, enabling precise extraction of physical characteristics through optical interaction
2Difficulty of detecting and measuring
If traditional measurement systems are implemented, then the system complexity is low, but the ability to detect and measure physical characteristics of adhesive materials and device flatness is insufficient
Solution Approach 1:
The patent replaces difficult-to-implement mechanical measurement approaches for adhesive material characteristics with optical measurement systems. The structured light projection and camera-based imaging provide straightforward detection of three-dimensional surface profiles, adhesive fillet geometries, and device flatness without complex mechanical scanning or contact probes
Solution Approach 2:
The patent changes the measurement parameter space by using optical intensity and phase information from structured light patterns instead of mechanical displacement or force measurements. This parameter transformation enables simultaneous measurement of multiple physical characteristics (adhesive volume, height, spread, device flatness) through a unified optical measurement approach
3Reliability
If multiple separate measurement systems are used for different physical characteristics, then each measurement can be optimized, but the overall device complexity and measurement time increase
Solution Approach 1:
The patent merges multiple measurement functions into a single integrated optical measurement system. The structured light projection and camera imaging simultaneously capture information about adhesive material characteristics (volume, height, spread, fillet geometry) and device flatness, eliminating the need for separate measurement systems and reducing total measurement time
Solution Approach 2:
The patent creates a universal measurement system that can measure multiple different physical characteristics using the same hardware platform. The structured light-based optical system universally measures adhesive volume, adhesive height, adhesive spread, fillet geometry, and device flatness through a single measurement process, improving efficiency and consistency across different measurement tasks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise measurement and control of adhesive material properties and semiconductor device flatness, ensuring compliance with design specifications and improving the bonding process efficiency.
Implementation Method 1
creating an image of the structured light pattern reflected by a surface of a semiconductor device using a camera
Data Source
AI summary
A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.