Structured Light Multilayer Cross-Section Visualization
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Solution Overview
Problem
Existing inspection methods for transparent semiconductor components in electronics manufacturing are inadequate for detecting internal defects in multilayer structures without causing damage to the workpiece.
Innovation Solution
A non-destructive method involving the projection of a structured light pattern onto a multilayer workpiece, capturing multiple structured light images at different focal depths, and generating a cross-sectional image by combining focus scores of each pixel intersected by a defined section plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If focused ion beam (FIB) is used to detect internal defects, then measurement precision is improved, but the workpiece is damaged
Solution Approach 1:
The patent replaces the mechanical/physical FIB system with an optical system using structured light projection and multi-focal-depth imaging. The structured light pattern is projected onto the workpiece, and images are captured at multiple focal depths to reconstruct internal cross-sectional information optically, eliminating the need for ion beam bombardment and subsequent workpiece damage.
Solution Approach 2:
The patent transitions from single-plane imaging to three-dimensional cross-sectional visualization by capturing images at multiple focal depths and reconstructing them into a cross-sectional view. This multi-dimensional approach enables internal defect detection without physical sectioning or destructive drilling.
2Ease of operation
If conventional inspection methods are used on transparent multilayer structures, then ease of operation is maintained, but measurement precision deteriorates due to inability to detect internal defects
Solution Approach 1:
The patent extends conventional single-plane optical inspection into the depth dimension by capturing images at multiple focal depths and reconstructing cross-sectional information. This maintains the ease of optical operation while enabling internal defect detection that was previously impossible with conventional surface-only inspection methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the effective detection of internal defects within multilayer structures without damaging the workpiece, providing a high-yield inspection process comparable to focused ion beam imaging.
Implementation Method 1
projecting a structured light pattern onto a workpiece... capturing a plurality of structured light images of the workpiece... determining a focus score for each pixel... wherein the focus score corresponds to a reflection of the structured light pattern reflected by the workpiece
Data Source
AI summary
The system includes a processor in electronic communication with a structured light assembly and an imaging assembly. The structured light assembly is configured to project a structured light pattern onto a workpiece, wherein the workpiece is a multilayer structure. The imaging assembly is configured to capture a plurality of structured light images of the workpiece, wherein each of the plurality of structured light images is captured with the imaging assembly being focused at a different height relative to the workpiece. The processor is configured to generate a cross-sectional image of the workpiece based on the plurality of structured light images received from the imaging assembly.