Structured Light Defect Inspection for Battery Nail Welding

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Solution Overview

Problem

There is a need for a convenient, efficient, and accurate method to inspect defects after sealing nails welding in lithium battery assembly, as existing methods face challenges in accuracy and efficiency due to various objective factors affecting welding processes.

Innovation Solution

A defect inspection method using a structured light camera device that acquires both two-dimensional and three-dimensional images of the target material, allowing for comprehensive defect inspection without the need to switch camera devices, thereby improving convenience and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If separate two-dimensional and three-dimensional camera devices are used for defect inspection, then comprehensive defect detection capability is improved, but device complexity and operation convenience deteriorate due to the need to switch between devices

Engineering Contradiction:
Improvedefect detection capabilityVSAvoidcamera device configuration
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines two-dimensional and three-dimensional imaging functions into a single integrated camera device. The device includes a two-dimensional image sensor and a three-dimensional image sensor that share common optical components and control systems, allowing both imaging modes to be performed without switching between separate devices. This merging approach maintains comprehensive defect detection capability while reducing device complexity and improving operational convenience.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The camera device is designed with multi-functionality to perform both two-dimensional and three-dimensional imaging tasks using a single device. The system can switch between different imaging modes as needed, providing universal defect inspection capability for various defect types and inspection requirements without requiring multiple specialized devices, thereby simplifying the overall system configuration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Loss of information

If multiple camera devices are used to acquire two-dimensional and three-dimensional images, then imaging completeness is improved, but inspection efficiency deteriorates due to the need to switch devices and coordinate data

Engineering Contradiction:
Improveimage information completenessVSAvoidinspection efficiency
Core Design Contradiction:
Loss of informationVSProductivity

Solution Approach 1:

By merging two-dimensional and three-dimensional imaging capabilities into a single camera device, the system eliminates the time and complexity associated with switching between devices. Both types of images are acquired simultaneously or in rapid succession using shared optical paths and synchronized sensors, ensuring complete image information while maintaining high inspection efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The camera device performs preliminary calibration and coordinate system alignment between the two-dimensional and three-dimensional sensors during setup. This preliminary action ensures that subsequent imaging operations can proceed without complex real-time data coordination, thereby maintaining high inspection efficiency while ensuring information completeness.

Inventive Principle:
Principle #10Preliminary action

3Measurement precision

If two-dimensional and three-dimensional images from different camera devices are used, then comprehensive inspection coverage is improved, but data processing complexity increases due to coordinate system unification requirements

Engineering Contradiction:
Improveinspection comprehensivenessVSAvoiddata processing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The integrated camera device uses shared optical components and a unified coordinate system for both two-dimensional and three-dimensional imaging. This merging approach ensures that images from both sensors are naturally aligned in the same reference frame, eliminating the need for complex post-processing coordinate unification operations while maintaining comprehensive inspection coverage.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system employs homogeneous data processing pipelines for both two-dimensional and three-dimensional images, using the same coordinate system and processing algorithms. This homogeneity simplifies data integration and analysis, reducing processing complexity while ensuring consistent and comprehensive defect inspection results across both image types.

Inventive Principle:
Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method ensures accurate and comprehensive defect inspection by utilizing multi-dimensional image information, reducing erroneous determinations, and improving the overall efficiency of the inspection process.

Implementation Method 1

a camera device being a structured light camera device integrating a two-dimensional image acquisition function and a three-dimensional image acquisition function

Methodology Applied
Scientific EffectStructured light:

Data Source

PatentUS20250200740A1Defect inspection method, system, and apparatus, device, storage medium, and computer program product
Publication Date: 2025.06.19 CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
  • US20250200740A1 patent drawing
  • US20250200740A1 patent drawing
  • US20250200740A1 patent drawing

AI summary

A defect inspection method includes controlling, in response to an inspection instruction for a target material, a camera device to acquire a two-dimensional image and a three-dimensional image of the target material, and determining a defect inspection result of the target material based on the two-dimensional image and the three-dimensional image of the target material.